The Effect of Wetting Gravity Regime on Shear Strength of SAC and Sn-Pb Solder Lap Joints

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dc.contributor.authorSona, M.
dc.contributor.authorPrabhu, K.N.
dc.date.accessioned2026-02-05T09:32:08Z
dc.date.issued2017
dc.description.abstractThe failure of solder joints due to imposed stresses in an electronic assembly is governed by shear bond strength. In the present study, the effect of wetting gravity regime on single-lap shear strength of Sn-0.3Ag-0.7Cu and Sn-2.5Ag-0.5Cu solder alloys reflowed between bare copper substrates as well as Ni-coated Cu substrates was investigated. Samples were reflowed for 10 s, T<inf>gz</inf> (time corresponding to the end of gravity regime) and 100 s individually and tested for single-lap shear strength. The single-lap shear test was also carried out on eutectic Sn-Pb/Cu- and Sn-Pb/Ni-coated Cu specimens to compare the shear strength values obtained with those of lead-free alloys. The eutectic Sn-Pb showed significantly higher ultimate shear strength on bare Cu substrates when compared to Sn-Ag-Cu alloys. However, SAC alloys reflowed on nickel-coated copper substrate exhibited higher shear strength when compared to eutectic Sn-Pb/Ni-coated Cu specimens. All the substrate/solder/substrate lap joint specimens that were reflowed for the time corresponding to the end of gravity regime exhibited maximum ultimate shear strength. © 2017, ASM International.
dc.identifier.citationJournal of Materials Engineering and Performance, 2017, 26, 9, pp. 4177-4187
dc.identifier.issn10599495
dc.identifier.urihttps://doi.org/10.1007/s11665-017-2857-6
dc.identifier.urihttps://idr.nitk.ac.in/handle/123456789/25522
dc.publisherSpringer New York LLC barbara.b.bertram@gsk.com
dc.subjectBinary alloys
dc.subjectCopper
dc.subjectCopper alloys
dc.subjectEutectics
dc.subjectJoints (structural components)
dc.subjectLead
dc.subjectLead alloys
dc.subjectLead-free solders
dc.subjectNickel
dc.subjectNickel alloys
dc.subjectNickel coatings
dc.subjectPlasma theory
dc.subjectShear flow
dc.subjectSilver
dc.subjectSilver alloys
dc.subjectSoldered joints
dc.subjectSoldering alloys
dc.subjectSubstrates
dc.subjectTernary alloys
dc.subjectTin
dc.subjectWetting
dc.subjectBare copper substrate
dc.subjectCopper substrates
dc.subjectElectronic assemblies
dc.subjectLead-free alloy
dc.subjectShear bond strengths
dc.subjectSingle lap shears
dc.subjectSingle-lap shear tests
dc.subjectUltimate shear strength
dc.subjectTin alloys
dc.titleThe Effect of Wetting Gravity Regime on Shear Strength of SAC and Sn-Pb Solder Lap Joints

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