Heat transfer analysis during the solidification of lead, tin, and two lead-base solder alloys against two different chill materials (steel and copper) was carried out with and without flux coating on the chill surface. Temperatures at two known locations inside the chill and casting were recorded as the casting started solidifying, and the acquired chill temperature data were used for solving a one-dimensional heat conduction equation inversely to yield the metal/chill interfacial heat flux and chill surface temperature as a function of time. The initial heat flux was high due to good contact at the metal/chill interface. As the casting started solidifying, there was a reduction in the heat flux due to the nonconforming contact at the interface. Chills with flux coating resulted in finer microstructures near the solder/substrate interface compared to those obtained with uncoated chills. The fineness of the microstructure also increased when copper was used as the chill material. The estimated total heat flow was found to be higher with flux-coated and copper chills. This was in good agreement with the finer microstructures obtained near the solder/chill interfacial region for solidification against copper chills and chills withflux coating on their surface.

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dc.contributor.authorPrabhu, K.
dc.contributor.authorKumar, S.T.
dc.contributor.authorVenkataraman, N.
dc.date.accessioned2026-02-05T11:00:30Z
dc.date.issuedHeat transfer at the metal/substrate interface during solidification of Pb-Sn solder alloys
dc.description.abstract2002
dc.identifier.citationJournal of Materials Engineering and Performance, 2002, 11, 3, pp. 265-273
dc.identifier.issn10599495
dc.identifier.urihttps://doi.org/10.1361/105994902770344051
dc.identifier.urihttps://idr.nitk.ac.in/handle/123456789/28002
dc.subjectCoatings
dc.subjectCopper
dc.subjectHeat flux
dc.subjectHeat transfer
dc.subjectInterfaces (materials)
dc.subjectLead alloys
dc.subjectMetal casting
dc.subjectMicrostructure
dc.subjectSolidification
dc.subjectSteel
dc.subjectTemperature
dc.subjectFlux coating
dc.subjectHeat flow
dc.subjectHeat transfer analysis
dc.subjectOne-dimensional heat conduction equation
dc.subjectSoldering alloys
dc.titleHeat transfer analysis during the solidification of lead, tin, and two lead-base solder alloys against two different chill materials (steel and copper) was carried out with and without flux coating on the chill surface. Temperatures at two known locations inside the chill and casting were recorded as the casting started solidifying, and the acquired chill temperature data were used for solving a one-dimensional heat conduction equation inversely to yield the metal/chill interfacial heat flux and chill surface temperature as a function of time. The initial heat flux was high due to good contact at the metal/chill interface. As the casting started solidifying, there was a reduction in the heat flux due to the nonconforming contact at the interface. Chills with flux coating resulted in finer microstructures near the solder/substrate interface compared to those obtained with uncoated chills. The fineness of the microstructure also increased when copper was used as the chill material. The estimated total heat flow was found to be higher with flux-coated and copper chills. This was in good agreement with the finer microstructures obtained near the solder/chill interfacial region for solidification against copper chills and chills withflux coating on their surface.

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