Experimental Investigation on Heat Spreader Integrated Microchannel Using Graphene Oxide Nanofluid

Abstract

Thermal design consideration is highly essential for efficient heat dissipation in advanced microprocessors which are subjected to conjugate heat transfer under high heat flux with a minimal area for cooling. Generally, these multicore processors develop a localized high density heat flux referred to as hotspot. The effective use of microchannel in order to mitigate the hotspot is found in literature; however, the flow induced hotspot still exist due to maldistribution of flow inside the microchannel. Henceforth, the present study provides an experimental insight on laminar forced convection in a parallel microchannel heat sink accompanied with 1.2 mm thin copper heat spreader with a surface area of 30 mm2 to effectively migrate the maldistribution flow induced hot spot. The present experimental study provides a profound insight about the hotspot and migration of hotspot to safe zones; as a result, not only the performance of the multi core microprocessor is highly improved but also the reliability of neighboring components is well secured. © 2019, © 2019 Taylor & Francis Group, LLC.