Rapid thermal processing for ULSI applications: An overview
| dc.contributor.author | Reid, K.G. | |
| dc.contributor.author | Sitaram, A.R. | |
| dc.date.accessioned | 2020-03-31T08:42:04Z | |
| dc.date.available | 2020-03-31T08:42:04Z | |
| dc.date.issued | 1996 | |
| dc.description.abstract | Rapid thermal processing (RTP) technology has made significant advances in recent years. Dynamic feedback, multizone control, and axially symmetric chamber design have helped to improve manufacturability and process control. This article will discuss historical and state-of-the-art RTP technology. Throughput and cycle time for conventional CMOS processes in RTP and batch furnaces will be compared. Cost of ownership (COO) for thermal processors will be discussed, highlighting the importance of throughput. | en_US |
| dc.identifier.citation | Solid State Technology, 1996, Vol.39, 2, pp.63-74 | en_US |
| dc.identifier.uri | https://idr.nitk.ac.in/handle/123456789/12742 | |
| dc.title | Rapid thermal processing for ULSI applications: An overview | en_US |
| dc.type | Article | en_US |