Heat Transfer During Solidification of Polyethylene Terephthalate (PET) in Injection Molding
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Date
2024
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Publisher
Springer
Abstract
In injection molding, heat transfer at the polymer/mold interface during solidification of the polymer significantly affects the cooling rate, microstructure, and hence the product quality. An accurate estimation of the boundary heat flux transients is essential for the successful simulation of polymer solidification, which can aid in predicting and preventing potential defects that may arise from improper filling and cooling. Simulation studies also help in optimizing the cycle time with different process parameters. In the present work, a pneumatically-operated injection molding machine capable of producing a single component in one cycle was designed and fabricated in-house to estimate the heat flux transients at the polymer/mold interface. The mold used for solidification of the polymer was made from tool steel (P20) with a simple rectangular cavity. The mold was instrumented with thermocouples across the thickness to record its thermal history during injection molding. The polymer/mold interfacial heat flux transients were estimated by solving an inverse heat conduction problem (IHCP). The temperature measured at locations beneath the cavity surface inside the mold was used as an input to the inverse solver. Altering the melt injection and mold temperatures showed negligible effects on heat flux transients at the polymer/mold interface. The estimated solidification time for the polymer sample was about 2 s. © The Indian Institute of Metals - IIM 2024.
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Keywords
Heat conduction, Injection molding, Inverse problems, Molds, Plastic bottles, Polyethylene terephthalates, Solidification, Thermocouples, Tool steel, Accurate estimation, Boundary heat flux, Cooling rates, Heat flux transients, Inverse heat conduction problem, Polymer molds, Polymer/mold interface, Potential defects, Products quality, Simulation studies, Heat flux
Citation
Transactions of the Indian Institute of Metals, 2024, 77, 10, pp. 3059-3065
