Effect of substrate surface texture and flux coating on the evolution of microstructure during solidification of lead free Sn-3.5Ag solder alloy

dc.contributor.author	Prabhu, K.N.
dc.contributor.author	Bali, R.
dc.contributor.author	Ranjan, R.
dc.date.accessioned	2020-03-31T08:23:13Z
dc.date.available	2020-03-31T08:23:13Z
dc.date.issued	2004
dc.description.abstract	The microstructure of a solidifying lead free Sn-3.5Ag solder alloy is found to be highly sensitive to the surface condition of the copper substrate. A transition from lamellar to fine fibrous eutectic structure is observed as the surface condition of the substrate is altered by increasing the surface roughness and application of flux. This is attributed to lowering of interfacial tension and improved wetting of the solidifying solder on the substrate material leading to a better contact at the metal/substrate interface. The results also indicated the importance of surface texture of the substrate and the application of the flux to the quality of the solder/substrate joint. 2003 Elsevier Ltd. All rights reserved.	en_US
dc.identifier.citation	Materials and Design, 2004, Vol.25, 5, pp.447-449	en_US
dc.identifier.uri	https://idr.nitk.ac.in/handle/123456789/10865
dc.title	Effect of substrate surface texture and flux coating on the evolution of microstructure during solidification of lead free Sn-3.5Ag solder alloy	en_US
dc.type	Article	en_US

Files

Now showing 1 - 1 of 1