Wetting behavior and evolution of microstructure of Sn-3.5Ag solder alloy on electroplated 304 stainless steel substrates

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dc.contributor.authorNayak, V.U.
dc.contributor.authorPrabhu, K.N.
dc.contributor.authorStanford, N.
dc.contributor.authorSatyanarayan, S.
dc.date.accessioned2026-02-06T06:40:29Z
dc.date.issued2012
dc.description.abstractIn the present study, wetting characteristics and evolution of microstructure of Sn-3.5Ag solder on Ag/Ni and Ni electroplated 304 stainless steel (304SS) substrates have been investigated. Solder alloy spread on Ag/Ni plated 304SS substrates exhibited better wetting as compared to Ni/304SS substrate. The formations of irregular shaped and coarser IMCs were found at the interface of solder/Ni/304SS substrate region whereas, solder/Ag/Ni/substrate interface showed continuous scallop and needle shaped IMCs. The precipitation of Ag<inf>3</inf>Sn, Ni-Sn, FeSn<inf>2</inf> and lesser percentage of Fe-Cr-Sn IMCs were found at the interface of solder/Ag/Ni/substrate region whereas, solder/Ni/304 SS substrate exhibited predominantly FeSn<inf>2</inf> and Fe-Cr-Sn IMCs. Presence of higher amount of Fe-Cr-Sn IMCs at the solder/Ni/304SS substrate interface inhibited the further wetting of solder alloy.
dc.identifier.citationTransactions of the Indian Institute of Metals, 2012, Vol.65, 6, p. 713-717
dc.identifier.issn9722815
dc.identifier.urihttps://doi.org/10.1007/s12666-012-0193-y
dc.identifier.urihttps://idr.nitk.ac.in/handle/123456789/32950
dc.publisherSpringer India sanjiv.goswami@springer.co.in
dc.subjectIMCs
dc.subjectLead free solder
dc.subjectReactive wetting
dc.subjectStainless steel
dc.titleWetting behavior and evolution of microstructure of Sn-3.5Ag solder alloy on electroplated 304 stainless steel substrates

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