Solder joint reliability of Sn-0·7Cu and Sn-0·3Ag- 0·7Cu lead-free solder alloys solidified on copper substrates with different surface roughnesses

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dc.contributor.authorSatyanarayan, S.
dc.contributor.authorPrabhu, K.
dc.date.accessioned2026-02-05T09:34:40Z
dc.date.issued2013
dc.description.abstractThe bond shear test was used to assess the integrity of Sn-0·7Cu and Sn-0·3Ag-0·7Cu lead-free solder alloy drops solidified on copper substrates with smooth and rough surface finishes. Solder alloys solidified on smooth substrates required higher shear force compared to that on rough substrates. Sn-0·3Ag-0·7Cu alloy required higher shear energy than Sn-0·7Cu alloy. Solder alloys solidified on smooth substrate surfaces exhibited complete ductile failure. On rough copper surfaces, solder alloys showed a transition ridge characterized by sheared intermetallic compounds (IMCs) and the presence of dimples. The peak shear strength decreased with increase in contact area of the solder bond on the substrate. Smooth surface and the presence of minor amount of Ag in the solder alloy enhance the integrity of the solder joint. © 2013 Institute of Materials, Minerals and Mining.
dc.identifier.citationMaterials Science and Technology (United Kingdom), 2013, 29, 12, pp. 1430-1440
dc.identifier.issn2670836
dc.identifier.urihttps://doi.org/10.1179/1743284713Y.0000000287
dc.identifier.urihttps://idr.nitk.ac.in/handle/123456789/26700
dc.subjectIMCs
dc.subjectLead free solders
dc.subjectShear energy
dc.subjectShear tests
dc.subjectSolder bonds
dc.subjectCopper
dc.subjectCopper alloys
dc.subjectCopper compounds
dc.subjectIntermetallics
dc.subjectSilver
dc.subjectSilver alloys
dc.subjectSoldered joints
dc.subjectSoldering alloys
dc.subjectSubstrates
dc.subjectSurface roughness
dc.subjectTin
dc.subjectTin alloys
dc.titleSolder joint reliability of Sn-0·7Cu and Sn-0·3Ag- 0·7Cu lead-free solder alloys solidified on copper substrates with different surface roughnesses

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