A Wi-Fi 6E Tri-Band Power Amplifier for WLAN Applications Featuring a Novel Re-configurable Matching Network
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Date
2025
Authors
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Journal ISSN
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Publisher
Birkhauser
Abstract
This article introduces a novel design methodology of a re-configurable tri-band matching network along with Power Amplifier (PA) that supports the latest WLAN applications. The implemented matching network/circuit, specifically designed for the 2.4 GHz band, enables amplifier to achieve a linear power exceeding 11 dBm. Incorporating the proposed matching circuit, standalone PA is designed to support tri-band operation (2.4 GHz, 5 GHz, and 6 GHz) for the emerging wireless local area network (WLAN) applications. These designs are realized using UMC 65 nm CMOS technology in commercial Cadence Virtuoso design environment with a core area occupying 0.33 mm2. In the 2.4/5/6-GHz WLAN bands, the power amplifier achieves a output power 1-dB compression (P<inf>1dB</inf>) point ranging from 20.3 to 22.4 dBm, with power-added efficiency (PAE) values ranging from 10 to 16%. The power amplifier delivers an average power output (P<inf>avg</inf>) of 11.6–14.5 dBm with an Error Vector Magnitude (EVM) of ? 35 dB for 80-MHz bandwidth WLAN 802.11ax source, with source EVM maintained at ? 50 dB. The standalone PA and novel matching circuit for 2.4 GHz presents one of the first published designs in the literature for tri-band WLAN applications. © The Author(s), under exclusive licence to Springer Science+Business Media, LLC, part of Springer Nature 2024.
Description
Keywords
Bandwidth compression, CMOS integrated circuits, Combinatorial circuits, Compaction, Dividing circuits (arithmetic), Integrated circuit design, Masers, Model structures, Power electronics, Structural analysis, Wi-Fi, 802.11ax, Error vector, Error vector magnitude, Local areas, Matching networks, Power, Tri-bands, Vector magnitude, Wireless local area network, Wireless local area network applications, Wireless local area networks (WLAN)
Citation
Circuits, Systems, and Signal Processing, 2025, 44, 3, pp. 1456-1477
