The Effect of Thermal Ageing on Solder/Substrate Interfacial Microstructures During Reflow of Sn–37Pb and Sn–3Ag–0.5Cu

Abstract

In the current study, the influence of thermal ageing on evolution of microstructures in the interfacial region between solders (Sn–37Pb, Sn–3.5Ag–0.5Cu) and copper substrates was investigated. Pb-containing and Pb-free solders were reflowed on Cu substrates at 230 °C for 15 min and were isothermally aged at 100 °C for 24 h. As-reflowed Sn–Pb solder/Cu substrate interfacial region exhibited continuous and layered type of IMC at the interface, and this IMC morphology changed to scallop type with isothermal ageing. SAC solder/Cu as-reflowed samples showed continuous and needle-shaped Cu<inf>6</inf>Sn<inf>5</inf> and Ag<inf>3</inf>Sn IMCs at the interface. However, in an isothermally aged condition, plate-shaped Cu<inf>6</inf>Sn<inf>5</inf> and flower-shaped Ag<inf>3</inf>Sn IMCs were found inside the solder matrix. Scanning electron microscopic (SEM) study showed that the thickness of Cu<inf>6</inf>Sn<inf>5</inf> IMC was higher in reflowed Sn–Pb/Cu region than in SAC/Cu region. © 2019, The Indian Institute of Metals - IIM.