Determination of spread activation energy and assessment of wetting behavior of solders on metallic substrates

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dc.contributor.authorPrabhu, K.N.
dc.contributor.authorKumar, G.
dc.date.accessioned2026-02-05T09:36:28Z
dc.date.issued2010
dc.description.abstractThe effects of substrate material, substrate surface roughness, and operating temperature on the wetting behavior of Sn-37Pb, Sn-3.5Ag, and Sn-9Zn eutectic solders on metallic substrates were investigated. Solder spreading kinetics was successfully represented by the exponential power law (EPL): ?=exp (-K ?n). The EPL parameter K has the significance of accelerating the kinetics of relaxation while the parameter n represents the resistance to spreading process (spread resistance parameter). EPL parameters exhibited a decreasing trend with an increase in surface roughness. Estimated activation energies for solder spreading were found to be in between those reported for inert and highly reactive spreading systems. © 2010 American Society of Mechanical Engineers.
dc.identifier.citationJournal of Electronic Packaging, 2010, 132, 4, pp. -
dc.identifier.issn10437398
dc.identifier.urihttps://doi.org/10.1115/1.4002899
dc.identifier.urihttps://idr.nitk.ac.in/handle/123456789/27528
dc.publisherAmerican Society of Mechanical Engineers (ASME)
dc.subjectActivation energy
dc.subjectBinary alloys
dc.subjectLead alloys
dc.subjectLead-free solders
dc.subjectMetal substrates
dc.subjectSurface roughness
dc.subjectTin alloys
dc.subjectZinc alloys
dc.subjectExponentials
dc.subjectMaterial substrates
dc.subjectMetallic substrate
dc.subjectOperating temperature
dc.subjectPower-law parameters
dc.subjectSn-37Pb
dc.subjectSolder spreading
dc.subjectSubstrate material
dc.subjectSubstrate surface
dc.subjectWetting behavior
dc.subjectWetting
dc.titleDetermination of spread activation energy and assessment of wetting behavior of solders on metallic substrates

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