Lead-free solders for high-temperature applications
| dc.contributor.author | Satyanarayan, S. | |
| dc.contributor.author | Narayan Prabhu, K. | |
| dc.date.accessioned | 2026-02-06T06:33:25Z | |
| dc.date.issued | 2025 | |
| dc.description.abstract | Due to the toxicity of Pb, efforts to develop alternatives to Pb-based solders have been increased significantly. However, only a limited number of lead (Pb)-free solder systems exist for high-temperature applications. In the present paper, a review of the selection of Pb-free solder alloys for high-temperature (300°C–400°C) applications to replace traditional Pb-based alloys is carried out. A discussion on the research and development of high-temperature solder alloys is highlighted in the current review. The solder systems with alloying additions like Au, Sb, Ni and Zn must be investigated to be used as potential candidate materials for high-temperature applications © 2025 by authors. | |
| dc.identifier.citation | Materials Research Proceedings, 2025, Vol.55, , p. 136-140 | |
| dc.identifier.issn | 24743941 | |
| dc.identifier.uri | https://doi.org/10.21741/9781644903612-20 | |
| dc.identifier.uri | https://idr.nitk.ac.in/handle/123456789/28638 | |
| dc.publisher | Association of American Publishers | |
| dc.subject | Alloying | |
| dc.subject | High Temperature | |
| dc.subject | Pb-Free Solders | |
| dc.subject | Wetting | |
| dc.title | Lead-free solders for high-temperature applications |