Aluminising of mild steel using Al-11Si-1.2Cu baths
| dc.contributor.author | Shashibhushan Raju, M. | |
| dc.contributor.author | Prashanth, H. | |
| dc.contributor.author | Bhat, K. | |
| dc.date.accessioned | 2026-02-05T09:34:40Z | |
| dc.date.issued | 2013 | |
| dc.description.abstract | Hot-dip aluminising of mild steel was done using Al-11Si-1.2Cu (at %) bath at 750°C for dipping time ranging from 300 to 3600 seconds. Aluminised layer was investigated using scanning electron microscope and energy dispersive spectroscopy. The intermetallic layer consisted of 4 distinct layers, namely, ?<inf>5</inf>-(Al<inf>7</inf>Fe<inf>2</inf>Si), ?-FeAl<inf>3</inf>, ?-Fe<inf>2</inf>Al<inf>5</inf> and ?<inf>1</inf>-(Al,Si)<inf>5</inf>Fe<inf>3</inf>. Total intermetallic layer thickness was following parabolic growth kinetics with time. Total thickness was increasing predominantly due to increase in Fe<inf>2</inf>Al<inf>5</inf> layer, which itself was following parabolic growth behaviour. Total intermetallic layer thickness was smaller compared to intermetallic layer thickness reported using pure aluminium or aluminium silicon baths. © 2013 CAFET-INNOVA TECHNICAL SOCIETY. | |
| dc.identifier.citation | International Journal of Earth Sciences and Engineering, 2013, 6, 4, pp. 717-721 | |
| dc.identifier.issn | 9745904 | |
| dc.identifier.uri | https://idr.nitk.ac.in/handle/123456789/26690 | |
| dc.subject | Aluminium-silicon | |
| dc.subject | Aluminum-silicon-copper bath | |
| dc.subject | Dipping time | |
| dc.subject | Hot dips | |
| dc.subject | Intermetallic layer | |
| dc.subject | Parabolic growth | |
| dc.subject | Pure aluminium | |
| dc.subject | Carbon steel | |
| dc.subject | Energy dispersive spectroscopy | |
| dc.subject | Scanning electron microscopy | |
| dc.subject | Silicon | |
| dc.subject | Aluminum | |
| dc.subject | aluminum | |
| dc.subject | copper | |
| dc.subject | reaction kinetics | |
| dc.subject | silicon | |
| dc.subject | steel | |
| dc.subject | temperature | |
| dc.title | Aluminising of mild steel using Al-11Si-1.2Cu baths |
