Effect of Multiple Reflow Cycles and Al2O3 Nanoparticles Reinforcement on Performance of SAC305 Lead-Free Solder Alloy

Abstract

The effect of Al<inf>2</inf>O<inf>3</inf> nanoparticles reinforcement on melting behavior, microstructure evolution at the interface and joint shear strength of 96.5Sn3Ag0.5Cu (SAC305) lead-free solder alloy subjected to multiple reflow cycles was investigated. The reinforced SAC305 solder alloy compositions were prepared by adding Al<inf>2</inf>O<inf>3</inf> nanoparticles in different weight fractions (0.05, 0.1, 0.3 and 0.5 wt.%) through mechanical dispersion. Cu/solder/Cu micro-lap-shear solder joint specimens were used to assess the shear strength of the solder joint. Differential scanning calorimetry was used to investigate the melting behavior of SAC305 solder nanocomposites. The solder joint interfacial microstructure was studied using scanning electron microscopy. The results showed that the increase in melting temperature (T<inf>L</inf>) and melting temperature range of the SAC305 solder alloy by addition of Al<inf>2</inf>O<inf>3</inf> nanoparticles were not significant. In comparison with unreinforced SAC305 solder alloy, the reinforcement of 0.05-0.5 wt.% of Al<inf>2</inf>O<inf>3</inf> nanoparticles improved the solder wettability. The addition of nanoparticles in minor quantity effectively suppressed the Cu<inf>6</inf>Sn<inf>5</inf> IMC growth, improved the solder joint shear strength and ductility under multiple reflow cycles. However, the improvement in solder properties was less pronounced on increasing the nanoparticle content above 0.1 wt.% of the solder alloy. © 2018, ASM International.