Wire Electro Discharge Machining Performance of TiNiCu Shape Memory Alloy

dc.contributor.authorManjaiah, M.
dc.contributor.authorNarendranath, S.
dc.contributor.authorBasavarajappa, S.
dc.date.accessioned2026-02-05T09:33:05Z
dc.date.issued2016
dc.description.abstractThe study presents the effect of Wire Electro Discharge Machining (WEDM) system parameters on the Material Removal Rate (MRR), surface roughness and surface morphology of Ti <inf>50</inf>Ni <inf>45</inf>Cu <inf>5</inf> SMA developed using vacuum arc melting. The WEDM parameters such as pulse on time, peak current, pulse off time and table feed were selected as control factors over MRR and surface roughness. The results reveal that the surface roughness and MRR increases with increased peak current, pulse on time and table feed but decreases slightly with pulse off time. Higher MRR was attained at 5Amps peak current and 70 ?m/s table feed. Better surface roughness was obtained for a combination of lower pulse on time, peak current and table feed with high pulse off time. Surface defects such as recast layer, craters, micro–cracks, pockmarks and voids were found on the machined surface. The globule of appendages formed around the craters and the intensity of the crater was evident for the higher surface roughness with an increase in peak current and pulse-on time during WEDM. © 2015, Springer Science+Business Media Dordrecht.
dc.identifier.citationSilicon, 2016, 8, 3, pp. 467-475
dc.identifier.issn1876990X
dc.identifier.urihttps://doi.org/10.1007/s12633-014-9273-4
dc.identifier.urihttps://idr.nitk.ac.in/handle/123456789/25977
dc.publisherSpringer Netherlands
dc.subjectCracks
dc.subjectShape memory effect
dc.subjectSurface defects
dc.subjectVacuum applications
dc.subjectWire
dc.subjectControl factors
dc.subjectMachined surface
dc.subjectMaterial removal rate
dc.subjectSMA
dc.subjectTiNiCu shape memory alloys
dc.subjectVacuum arc melting
dc.subjectWEDM
dc.subjectWire electro discharge machining
dc.subjectSurface roughness
dc.titleWire Electro Discharge Machining Performance of TiNiCu Shape Memory Alloy

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