Wetting behavior and evolution of microstructure of Sn-3.5Ag solder alloy on electroplated 304 stainless steel substrates

Simple item page
dc.contributor.authorNayak, V.U.
dc.contributor.authorPrabhu, K.N.
dc.contributor.authorStanford, N.
dc.contributor.authorSatyanarayan
dc.date.accessioned2020-03-30T09:46:25Z
dc.date.available2020-03-30T09:46:25Z
dc.date.issued2012
dc.description.abstractIn the present study, wetting characteristics and evolution of microstructure of Sn-3.5Ag solder on Ag/Ni and Ni electroplated 304 stainless steel (304SS) substrates have been investigated. Solder alloy spread on Ag/Ni plated 304SS substrates exhibited better wetting as compared to Ni/304SS substrate. The formations of irregular shaped and coarser IMCs were found at the interface of solder/Ni/304SS substrate region whereas, solder/Ag/Ni/substrate interface showed continuous scallop and needle shaped IMCs. The precipitation of Ag3Sn, Ni-Sn, FeSn2 and lesser percentage of Fe-Cr-Sn IMCs were found at the interface of solder/Ag/Ni/substrate region whereas, solder/Ni/304 SS substrate exhibited predominantly FeSn2 and Fe-Cr-Sn IMCs. Presence of higher amount of Fe-Cr-Sn IMCs at the solder/Ni/304SS substrate interface inhibited the further wetting of solder alloy.en_US
dc.identifier.citationTransactions of the Indian Institute of Metals, 2012, Vol.65, 6, pp.713-717en_US
dc.identifier.urihttps://idr.nitk.ac.in/handle/123456789/6926
dc.titleWetting behavior and evolution of microstructure of Sn-3.5Ag solder alloy on electroplated 304 stainless steel substratesen_US
dc.typeBook chapteren_US

Files

Original bundle

Now showing 1 - 1 of 1
Thumbnail Image
Name:
6926.pdf
Size:
393.5 KB
Format:
Adobe Portable Document Format
Download

Collections

2. Conference Papers