TLM-NoC: Two Level Mesh Network-on-Chip for Performance Improvement
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Date
2022
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Publisher
Institute of Electrical and Electronics Engineers Inc.
Abstract
As the number of cores integrated into a system-on-chip (SoC) increases, the role played by this on-chip communication system becomes more and more critical due to communication bottleneck and scalability. The network-on-chip (NoC) design paradigm is today recognized as the most viable communication infrastructure over SoCs. However, the former architecture imposes latency concerns while the network size increases resulting in significant performance degradation. This paper finds an alternative solution for improving mesh NoCs, especially when long-distance communication takes place. The proposed solution suggests a variant of the 2D mesh topology named 'two-level mesh - network-on-chip (TLM-NoC)' in which a baseline mesh includes sparse mesh interconnection at the upper layer. The upper layer primarily establishes long-distance communications between nodes which in turn reduces latency and improves other metrics. Experimental results show adequate performance improvements by the TLM-NoC over traditional meshes. Evaluation of TLM-NoC shows latency improvement by 17.97%, resulting in 33.33% packet flit loss reduction and 26.80 % increased throughput. Further, the proposed architecture consumes 23.69% less energy for delivering traffic. © 2021 IEEE.
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Keywords
end-to-end latency, network performance evaluation, performance-efficient communication, TLM-NoC
Citation
2021 IEEE 23rd International Conference on High Performance Computing and Communications, 7th International Conference on Data Science and Systems, 19th International Conference on Smart City and 7th International Conference on Dependability in Sensor, Cloud and Big Data Systems and Applications, HPCC-DSS-SmartCity-DependSys 2021, 2022, Vol., , p. 813-818
