Influence of dielectric flushing conditions during WEDM of TiNiCu shape memory alloys
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Date
2019
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ICE Publishing subscriptions@icepublishing.com
Abstract
In this study, the effect of dielectric flushing pressure and direction on the machining responses of wire electrodischarge machining (WEDM) was investigated. Vacuum-melted titanium-nickel-copper (TiNiCu) shape memory alloy Ti50Ni25Cu25, homogenized at 500°C, was used as the workpiece material. The flushing pressure was varied from 0.5 to 1.5 kg/cm2 along with pulse-on time (T on), pulse-off time (T off), servo voltage and wire feed rate for Taguchi's L27 experiments. Cutting rate (CR) and kerf width were selected as major WEDM responses, and at optimal CR, the effect of the flushing direction on surface characteristics was studied. It was found that the surface morphology depended mainly on process parameter values and was greatly affected by the flushing pressure. Also, the amount of molten and resolidified debris on samples, machined with the upward-direction flow, was much higher compared with that for the downward-direction flow. © 2019 ICE Publishing: All rights reserved.
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Keywords
Copper alloys, Morphology, Surface morphology, Ternary alloys, Titanium alloys, Dielectric flushing, Process parameter values, Surface characteristics, TiNiCu shape memory alloys, Titanium-nickel, Wire electro-discharge machining, Wire feed rate, Workpiece materials, Shape-memory alloy
Citation
Emerging Materials Research, 2019, 8, 3, pp. 376-386