Effect of thermal contact heat transfer on solidification of Pb-Sn and Pb-free solders

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dc.contributor.authorChellaih, T.
dc.contributor.authorKumar, G.
dc.contributor.authorPrabhu, K.N.
dc.date.accessioned2026-02-05T09:37:08Z
dc.date.issued2007
dc.description.abstractThe effect of thermal contact heat transfer on the solidification of spherical droplets of four solder alloys, namely, Sn-37Pb, Sn-9Zn, Sn-0.7Cu and Sn-3.5Ag, was studied using SOLIDCAST simulation package. A significant drop in the arrest time was observed for increase in heat transfer coefficient from 1000 to 2000 W/m2 K. Effect of contact conductance and thermal diffusivity of solder alloys on arrest time is quantified by the power relation, ? = m(?{symbol})n where ? and ?{symbol} are defined as arrest time and heat transfer parameters, respectively. Experiments were also carried out to investigate the effect of cooling rate on solidification behaviour of the solder alloys used in simulation. The results indicated the significant effect of mould material on interfacial heat flux and metallurgical microstructure. © 2005 Elsevier Ltd. All rights reserved.
dc.identifier.citationMaterials and Design, 2007, 28, 3, pp. 1006-1011
dc.identifier.issn2641275
dc.identifier.urihttps://doi.org/10.1016/j.matdes.2005.11.011
dc.identifier.urihttps://idr.nitk.ac.in/handle/123456789/27841
dc.publisherElsevier Ltd
dc.subjectComputer simulation
dc.subjectCooling
dc.subjectHeat flux
dc.subjectHeat transfer coefficients
dc.subjectMetallographic microstructure
dc.subjectSolidification
dc.subjectThermal conductivity
dc.subjectThermal diffusion
dc.subjectSoftware package SOLIDCAST
dc.subjectSpherical droplets
dc.subjectThermal contact heat transfer
dc.subjectSoldering alloys
dc.titleEffect of thermal contact heat transfer on solidification of Pb-Sn and Pb-free solders

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