Thermal studies of a MEMS-based pressure sensor for aerospace applications

dc.contributor.authorKrishna, B.G.
dc.contributor.authorMurthy, K.R.
dc.contributor.authorKhan, K.Z.
dc.contributor.authorMadav, V.
dc.contributor.authorAshok Babu, T.P.
dc.date.accessioned2026-02-03T13:20:29Z
dc.date.issued2025
dc.description.abstractThe main objective of this study is to enhance heat transfer for the reduction of temperature in MEMS-based piezoresistive high-temperature pressure sensors. The main parameter that affects the sensor performance especially for Aerospace applications is higher operating temperature because there are many electronic components and devices that may fail due to higher temperatures. Prevention of overheating of the electronic components in the sensor is a challenge; hence, the study of heat transfer from hydraulic fluid is of utmost importance. Different types of fin surfaces to enhance the heat transfer rate are studied using ANSYS CFD (computational fluid dynamics). CFD simulations and experiments are carried out to design novel high operating temperature pressure sensors for aerospace applications. This in turn improves performance due to internal thermo-piezoresistive amplification. In this paper, high-temperature pressure sensors are designed by CFD analyses and experimentally analyzed for a better understanding of the distribution of temperature in the pressure sensor and thermal variation in the sensor and observe the changes during analysis. Extended fin surface concepts are introduced for better heat transfer and to reduce the fluid temperature inside the sensor that is transferred to the electronic components. ANSYS CFD analysis is carried out to determine the temperature distribution and two models are identified for experimental validation. © 2024 Wiley Periodicals LLC.
dc.identifier.citationHeat Transfer, 2025, 54, 1, pp. 375-388
dc.identifier.issn26884534
dc.identifier.urihttps://doi.org/10.1002/htj.23179
dc.identifier.urihttps://idr.nitk.ac.in/handle/123456789/20537
dc.publisherJohn Wiley and Sons Inc
dc.subjectComputer resource management
dc.subjectHydraulic fluids
dc.subjectMicrochannels
dc.subjectPressure transducers
dc.subjectSignal receivers
dc.subjectThermal modeling
dc.subjectANSYS computational fluid dynamic
dc.subjectComputational fluid
dc.subjectElectronic component
dc.subjectExtended fin surface
dc.subjectFin surface
dc.subjectFluid-dynamics
dc.subjectHigh-temperature pressure sensor
dc.subjectMEMS pressure sensor
dc.subjectPiezo-resistive
dc.subjectThermal
dc.subjectFins (heat exchange)
dc.titleThermal studies of a MEMS-based pressure sensor for aerospace applications

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