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Item Wetting behavior of solders(2010) Kumar, G.; Prabhu, K.N.Lead bearing solders have been used extensively in the assembly of modern electronic circuits. However, increasing environmental and health concerns about the toxicity of lead has led to the development of lead-free solders. Wetting of solders on surfaces is a complex and important phenomenon that affects the interfacial microstructure and hence the reliability of a solder joint. The solder material reacts with a small amount of the base metal and wets the metal by intermetallic compound (IMC) formation. The degree and rate of wetting are the two important parameters that characterize the wetting phenomenon. Contact angle is a measure of the degree of wetting or wettability of a surface by a liquid. Spreading kinetics in a given system is strongly affected by the experimental conditions. In reactive systems like soldering, wetting and chemical interfacial reactions are interrelated, and hence for successful modeling, it is essential to assess the effect of interfacial reactions on kinetics of wetting. Solder wetting necessarily involves the metallurgical reactions between the filler metal and the base metal. This interaction at the solder/base metal interface results in the formation of IMCs. During soldering an additional driving force besides the imbalance in interfacial energies originates from the interfacial reactions. The formation of IMC has significant influence on contact angle. The presence of IMCs (thin, continuous, and uniform layer) between solders and substrate metals is an essential requirement for good bonding. Optimum thickness of an IMC layer offers better wettability and an excellent solder joint reliability. However, due to their inherent brittle nature and tendency to generate structural defects, a too thick IMC layer at the interface may degrade the joint. In this paper, the factors affecting the wetting behavior of solders and evolution of interfacial microstructure are reviewed and discussed. Copyright � 2010 by ASTM International.Item Wetting behaviour and evolution of microstructure of Sn-Ag-Zn solders on copper substrates with different surface textures(2010) Satyanarayan; Prabhu, K.N.The effect of surface roughness on wetting behaviour and evolution of microstructure of two lead-free solders (Sn-2.625Ag-2.25Zn and Sn-1.75Ag-4.5Zn) on copper substrate was investigated. Both solders exhibited good wettability on copper substrates having rough surface and lower wettabilty on smooth surfaces. The contact angles of solders decreased linearly with increase in surface roughness of the substrate. The exponential power law, ?=exp(-K ?n), was used to model the relaxation behaviour of solders. A high intermetallic growth was observed at the interface particularly on copper substrates with rough surface texture. A thin continuous interface showing scallop intermetallic compounds (IMC) was obtained on smooth surfaces. With an increase in surface roughness, the IMC morphology changed from scallop shaped to needle type at the Sn-2.625Ag-2.25Zn solder/substrate interface and nodular to plate like IMCs for Sn-1.75Ag-4.5Zn solder matrix. Copyright � 2010 by ASTM International.Item Thermal contact at solder/substrate interfaces during solidification(2009) Nyamannavar, S.; Prabhu, K.N.Heat flux transients at the solder/substrate interface during the solidification of Sn-37Pb and Sn-3.5Ag solder alloys against metallic substrates were estimated by the lumped heat capacitance model and the contact condition was assessed by scanning electronic microscopy (SEM). Copper substrates yielded maximum contact heat flux followed by brass and aluminium substrates. The SEM study in the solder/substrate interfacial region revealed the existence of a clear gap with the aluminium substrate. A conforming contact was obtained with copper and brass substrates. 2009 Institute of Materials, Minerals and Mining.Item Metal/quenchant interfacial heat flux transients during quenching in conventional quench media and vegetable oils(2003) Prabhu, K.N.; Prasad, A.The determination of quench severity and the quantification of the boundary conditions at the metal/quenchant interface would be of considerable utility to the heat treating community. In the present work, an attempt has been made to determine the quench severity of various quench media including three vegetable oils, by the Grossmann Hardenability Factor method and by estimation of heat flux transients by inverse modeling of heat conduction in 304 stainless steel quench probes. The heat flux transient technique was found to be more accurate than the Grossmann technique in assessing the severity of quenching. This finding was supported by the hardness data and microstructure @@@ with the quenched steel specimens. New heat flux parameters are proposed to assess the severity of quenching. The boundary heat flux transients during end quenching of AISI 1040 steel specimens were also estimated. The estimated heat flux transients could be used for modeling of heat transfer during quenching. An attempt has also been made in the present work to assess the feasibility of three vegetable oils, namely coconut, sunflower, and groundnut oils, as quenching media. Further investigation is required in this direction to explore the suitability of these oils for industrial heat treating applications. This application would have immense environmental and economical benefits.Item Nanoquenchants for industrial heat treatment(2008) Prabhu, K.N.; Fernades, P.The present work outlines the possibility of using nanofluids for industrial heat treatment. Development of nanoquenchants having (i) high quench severity for enhancement of heat transfer for thick sections with low quench sensitivity and (ii) low cooling severity for thin sections with high quench sensitivity would be extremely useful to the heat treating community. The temperature dependent heat transfer coefficient and the wettability of the medium are the two important parameters that can be used to characterize a nanoquenchant to assess its suitability for industrial heat treatment. 2007 ASM International.Item Modification of eutectic silicon in Al-Si alloys(2008) Hegde, S.; Prabhu, K.N.The mechanical properties of Al-Si alloys are strongly related to the size, shape and distribution of eutectic silicon present in the microstructure In order to improve mechanical properties, these alloys are generally subjected to modification melt treatment, which transforms the acicular silicon morphology to fibrous one resulting in a noticeable improvement in elongation and strength. Improper melt treatment procedures, fading and poisoning of modifiers often result in the structure which is far from the desired one. Hence it is essential to assess the effectiveness of melt treatment before pouring. A much investigated reliable thermal analysis technique is generally used for this purpose. The deviation from the standard curve in thermal analysis helps in assessing the level of refinement of the Si structure. In the present review an attempt is made to discuss various aspects of modification, including mechanism, interaction of defects and non-destructive assessment by thermal analysis. 2008 Springer Science+Business Media, LLC.Item Heat flux transients at the solder/substrate interface in dip soldering(2008) Nyamannavar, S.; Prabhu, K.N.In the present work an experimental set-up was designed to simulate the dip soldering conditions. The set-up was used to estimate heat flux transients at the solder/substrate interface during solidification of Sn 3.5Ag solder against copper substrate. The inverse heat conduction problem (IHCP) was solved in the substrate region for estimation of heat flux transients. A reasonably good agreement between measurements and model predictions was achieved validating the inverse model. The computer code developed in the present study could be used to assess the effect of process variables on contact heat flux at the solder/substrate interface.Item Heat flux transients at the casting/chill interface during solidification of aluminum base alloys(1991) Kumar, T.S.P.; Prabhu, K.N.Heat flow at the metal/chill interface of bar-type castings of aluminum base alloys was modeled as a function of thermophysical properties of the chill material and its thickness. Experimental setup for casting square bars of Al-13.2 pct Si eutectic and Al-3 pet Cu-4.5 pct Si long freezing range alloys with chill at one end exposed to ambient conditions was fabricated. Experiments were carried out for different metal/chill combinations with and without coatings. The thermal history at nodal locations in the chill obtained during the experiments was used to estimate the interface heat flux by solving a one-dimensional Fourier heat conduction equation inversely. Using the data on transient heat flux q, the heat flow at the casting/chill interface was modeled in two steps: (1) The peak in the heat flux curve qmax was modeled as a power function of the ratio of the chill thickness d to its thermal diffusivity a, and (2) the factor (q/qmax) X ?0.05 was also modeled as a power function of the time after the solidification set in. The model was validated for Cu-10 pct Sn -2 pct Zn alloy chill and Al-13.2 pct Si and Al-3 pct Cu-4.5 pct Si as the casting alloys. The heat flux values estimated using the model were used as one of the boundary conditions for solidification simulation of the test casting. The experimental and simulated temperature distributions inside the casting were found to be in good agreement. 1991 The Minerals, Metals & Material Society.Item Investigation into creep behaviour of Sn-40%Pb alloy using impression creep method(2009) Prasanna, H.U.; Udupa, K.R.; Prabhu, K.N.The creep behaviour of Sn-40%Pb hypereutectic alloys cast in the molds made of different materials was investigated using impression creep technique in the temperature range from zero to 32 C and under the punching stress of 50 MPa. The creep curves.ie, profiles of indentation depth against time are generated and steady state creep rates (SSCRs) are determined. Activation energy was calculated knowing creep rates at different temperature levels. Standard metallographic technique was used to determine the grain size of alloys which were poured into different molds. It was found that SSCR, at all the temperature levels of testing, is a function of grain size of the material. The activation energy being in the range of 10kJ/mol -12 kJ/mol, suggests that the probable creep mechanism is dislocation glide aided by vacancy diffusion. Results of the experiments are discussed.Item Heat transfer during quenching of modified and unmodified gravity die-cast A357 cylindrical bars(2006) Prabhu, K.N.; Hemanna, P.Heat transfer during quenching of chill-cast modified and unmodified A357 Al-Si alloy was examined using a computer-aided cooling curve analysis. Water at 60 C and a vegetable oil (palm oil) were used as quench media. The measured temperatures inside cylindrical probes of the A357 alloy were used as inputs in an inverse heat-conduction model to estimate heat flux transients at the probe/quenchant interface and the surface temperature of the probe in contact with the quench medium. It was observed that modified alloy probes yielded higher cooling rates and heat flux transients. The investigation clearly showed that the heat transfer during quenching depends on the casting history. The increase in the cooling rate and peak heat flux was attributed to the increase in the thermal conductivity of the material on modification melt treatment owing to the change in silicon morphology. Fine and fibrous silicon particles in modified A357 probes increase the conductance of the probe resulting in higher heat transfer rates. This was confirmed by measuring the electrical conductivity of modified samples, which were found to be higher than those of unmodified samples. The ultrasound velocity in the probes decreased on modification. ASM International.