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Item Metal/quenchant interfacial heat flux transients during quenching in conventional quench media and vegetable oils(2003) Prabhu, K.N.; Prasad, A.The determination of quench severity and the quantification of the boundary conditions at the metal/quenchant interface would be of considerable utility to the heat treating community. In the present work, an attempt has been made to determine the quench severity of various quench media including three vegetable oils, by the Grossmann Hardenability Factor method and by estimation of heat flux transients by inverse modeling of heat conduction in 304 stainless steel quench probes. The heat flux transient technique was found to be more accurate than the Grossmann technique in assessing the severity of quenching. This finding was supported by the hardness data and microstructure @@@ with the quenched steel specimens. New heat flux parameters are proposed to assess the severity of quenching. The boundary heat flux transients during end quenching of AISI 1040 steel specimens were also estimated. The estimated heat flux transients could be used for modeling of heat transfer during quenching. An attempt has also been made in the present work to assess the feasibility of three vegetable oils, namely coconut, sunflower, and groundnut oils, as quenching media. Further investigation is required in this direction to explore the suitability of these oils for industrial heat treating applications. This application would have immense environmental and economical benefits.Item Nanoquenchants for industrial heat treatment(2008) Prabhu, K.N.; Fernades, P.The present work outlines the possibility of using nanofluids for industrial heat treatment. Development of nanoquenchants having (i) high quench severity for enhancement of heat transfer for thick sections with low quench sensitivity and (ii) low cooling severity for thin sections with high quench sensitivity would be extremely useful to the heat treating community. The temperature dependent heat transfer coefficient and the wettability of the medium are the two important parameters that can be used to characterize a nanoquenchant to assess its suitability for industrial heat treatment. 2007 ASM International.Item Modification of eutectic silicon in Al-Si alloys(2008) Hegde, S.; Prabhu, K.N.The mechanical properties of Al-Si alloys are strongly related to the size, shape and distribution of eutectic silicon present in the microstructure In order to improve mechanical properties, these alloys are generally subjected to modification melt treatment, which transforms the acicular silicon morphology to fibrous one resulting in a noticeable improvement in elongation and strength. Improper melt treatment procedures, fading and poisoning of modifiers often result in the structure which is far from the desired one. Hence it is essential to assess the effectiveness of melt treatment before pouring. A much investigated reliable thermal analysis technique is generally used for this purpose. The deviation from the standard curve in thermal analysis helps in assessing the level of refinement of the Si structure. In the present review an attempt is made to discuss various aspects of modification, including mechanism, interaction of defects and non-destructive assessment by thermal analysis. 2008 Springer Science+Business Media, LLC.Item Heat flux transients at the solder/substrate interface in dip soldering(2008) Nyamannavar, S.; Prabhu, K.N.In the present work an experimental set-up was designed to simulate the dip soldering conditions. The set-up was used to estimate heat flux transients at the solder/substrate interface during solidification of Sn 3.5Ag solder against copper substrate. The inverse heat conduction problem (IHCP) was solved in the substrate region for estimation of heat flux transients. A reasonably good agreement between measurements and model predictions was achieved validating the inverse model. The computer code developed in the present study could be used to assess the effect of process variables on contact heat flux at the solder/substrate interface.Item Heat flux transients at the casting/chill interface during solidification of aluminum base alloys(1991) Kumar, T.S.P.; Prabhu, K.N.Heat flow at the metal/chill interface of bar-type castings of aluminum base alloys was modeled as a function of thermophysical properties of the chill material and its thickness. Experimental setup for casting square bars of Al-13.2 pct Si eutectic and Al-3 pet Cu-4.5 pct Si long freezing range alloys with chill at one end exposed to ambient conditions was fabricated. Experiments were carried out for different metal/chill combinations with and without coatings. The thermal history at nodal locations in the chill obtained during the experiments was used to estimate the interface heat flux by solving a one-dimensional Fourier heat conduction equation inversely. Using the data on transient heat flux q, the heat flow at the casting/chill interface was modeled in two steps: (1) The peak in the heat flux curve qmax was modeled as a power function of the ratio of the chill thickness d to its thermal diffusivity a, and (2) the factor (q/qmax) X ?0.05 was also modeled as a power function of the time after the solidification set in. The model was validated for Cu-10 pct Sn -2 pct Zn alloy chill and Al-13.2 pct Si and Al-3 pct Cu-4.5 pct Si as the casting alloys. The heat flux values estimated using the model were used as one of the boundary conditions for solidification simulation of the test casting. The experimental and simulated temperature distributions inside the casting were found to be in good agreement. 1991 The Minerals, Metals & Material Society.Item Heat transfer during quenching of modified and unmodified gravity die-cast A357 cylindrical bars(2006) Prabhu, K.N.; Hemanna, P.Heat transfer during quenching of chill-cast modified and unmodified A357 Al-Si alloy was examined using a computer-aided cooling curve analysis. Water at 60 C and a vegetable oil (palm oil) were used as quench media. The measured temperatures inside cylindrical probes of the A357 alloy were used as inputs in an inverse heat-conduction model to estimate heat flux transients at the probe/quenchant interface and the surface temperature of the probe in contact with the quench medium. It was observed that modified alloy probes yielded higher cooling rates and heat flux transients. The investigation clearly showed that the heat transfer during quenching depends on the casting history. The increase in the cooling rate and peak heat flux was attributed to the increase in the thermal conductivity of the material on modification melt treatment owing to the change in silicon morphology. Fine and fibrous silicon particles in modified A357 probes increase the conductance of the probe resulting in higher heat transfer rates. This was confirmed by measuring the electrical conductivity of modified samples, which were found to be higher than those of unmodified samples. The ultrasound velocity in the probes decreased on modification. ASM International.Item Heat transfer at the metal/substrate interface during solidification of Pb-Sn solder alloys(2002) Prabhu, K.N.; Kumar, S.T.; Venkataraman, N.Heat transfer analysis during the solidification of lead, tin, and two lead-base solder alloys against two different chill materials (steel and copper) was carried out with and without flux coating on the chill surface. Temperatures at two known locations inside the chill and casting were recorded as the casting started solidifying, and the acquired chill temperature data were used for solving a one-dimensional heat conduction equation inversely to yield the metal/chill interfacial heat flux and chill surface temperature as a function of time. The initial heat flux was high due to good contact at the metal/chill interface. As the casting started solidifying, there was a reduction in the heat flux due to the nonconforming contact at the interface. Chills with flux coating resulted in finer microstructures near the solder/substrate interface compared to those obtained with uncoated chills. The fineness of the microstructure also increased when copper was used as the chill material. The estimated total heat flow was found to be higher with flux-coated and copper chills. This was in good agreement with the finer microstructures obtained near the solder/chill interfacial region for solidification against copper chills and chills withflux coating on their surface.Item Heat transfer and solidification behaviour of modified A357 alloy(2007) Kumar, G.; Hegde, S.; Prabhu, K.N.Al-Si alloys are subjected to melt treatment like modification to improve their mechanical properties. Non-destructive technique like thermal analysis is generally used to assess the effectiveness of melt treatment. In the present study, the behaviour of the melt treated Al-7Si-Mg alloy (A357) during solidification with or without chilling was investigated using thermal analysis. Thermal analysis and heat transfer parameters were determined. Thermal analysis parameters were affected significantly by modification and chilling. Modification treatment resulted in the increase of cooling rate, heat evolved, casting/mould interfacial heat flux and eutectic growth velocity. A theoretical model based on undercooling from the equilibrium temperature during eutectic solidification was used to predict growth velocities and eutectic grain size. The eutectic grain sizes estimated using the model and those measured from casting microstructures were found to be in good agreement. 2006 Elsevier B.V. All rights reserved.Item Effect of thermal contact heat transfer on solidification of Pb-Sn and Pb-free solders(2007) Chellaih, T.; Kumar, G.; Prabhu, K.N.The effect of thermal contact heat transfer on the solidification of spherical droplets of four solder alloys, namely, Sn-37Pb, Sn-9Zn, Sn-0.7Cu and Sn-3.5Ag, was studied using SOLIDCAST simulation package. A significant drop in the arrest time was observed for increase in heat transfer coefficient from 1000 to 2000 W/m2 K. Effect of contact conductance and thermal diffusivity of solder alloys on arrest time is quantified by the power relation, ? = m(?{symbol})n where ? and ?{symbol} are defined as arrest time and heat transfer parameters, respectively. Experiments were also carried out to investigate the effect of cooling rate on solidification behaviour of the solder alloys used in simulation. The results indicated the significant effect of mould material on interfacial heat flux and metallurgical microstructure. 2005 Elsevier Ltd. All rights reserved.Item Effect of surface roughness on metal/quenchant interfacial heat transfer and evolution of microstructure(2007) Prabhu, K.N.; Fernandes, P.In the present work, the effect of surface roughness on heat transfer rates in various quenchants was determined. The heat flux transients at the probe/quenchant interface were estimated by inverse modeling of heat conduction during end quenching of stainless steel probes with three different surface roughness (grooved, Ra = 3.0 and 1 ?m). Heat transfer during quenching was correlated with the hardness obtained for medium carbon AISI 1060 steel specimens. The effect of surface roughness on heat transfer rate during quenching in water and brine was significant for rough surface whereas its effect on heat transfer rate is only marginal in high viscosity oil quenchants. A fully martensitic structure was observed with grooved surface subjected to water quenching. With a smooth surface a mixed microstructure was obtained. The oil quenched specimens were found to be less sensitive to surface roughness. 2005 Elsevier Ltd. All rights reserved.
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