Faculty Publications
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Item Electroplating and characterization of Zn-Ni, Zn-Co and Zn-Ni-Co alloys(2010) Eliaz, N.; Venkatakrishna, K.; Hegde, A.C.Zn-Ni, Zn-Co and Zn-Ni-Co coatings were electrodeposited on mild steel from an acidic chloride bath containing p-aminobenzenesulphonic acid (SA) and gelatin. These additives changed the phase content in the coatings, most likely as a result of their adsorption at the surface of the cathode. The effect of gelatin was more pronounced than that of SA. The Faradaic efficiency was higher than 90%. As the current density was increased or the bath temperature was decreased, the concentration of the nobler metal in the coating increased. Both concentrations of Ni and Co in the ternary alloy increased as the applied current density was increased. Nickel and cobalt were found to have a synergistic catalytic effect. The thickness of all coatings increased as the applied current density was increased. The hardness increased with current density to a peak value, and then decreased. The rate of Zn deposition was heavily influenced by mass-transport limitation at high applied current densities, while the rates of Ni and Co deposition were not. The anomalous codeposition was explained by the great difference between the exchange current densities of Zn and the iron-group metal. Potentiodynamic polarization scans and electrochemical impedance spectroscopy showed that the corrosion resistance of the ternary Zn-Ni-Co alloy coatings was approximately 10 times higher than that of Zn-Ni and 7 times higher than that of Zn-Co. The improved corrosion resistance of the ternary alloy was attributed to its surface chemistry, phase content, texture, and surface morphology. The ternary Zn-Ni-Co coating may thus replace the conventional Zn-Ni and Zn-Co coatings in a variety of applications. © 2010 Elsevier B.V.Item Electrodeposition of Zn-Ni, Zn-Fe and Zn-Ni-Fe alloys(2010) Hegde, A.C.; Venkatakrishna, K.; Eliaz, N.Zn-Fe, Zn-Ni and Zn-Ni-Fe coatings were electrodeposited galvanostatically on mild steel from acidic baths (pH 3.5) consisted of ZnCl2, NiCl2, FeCl2, gelatin, sulfanilic (p-aminobenzenesulfonic) acid and ascorbic acid. Cyclic voltammetry showed that the effect of gelatin was more pronounced than that of sulfanilic acid, and that the deposition of the ternary alloy behaved differently from the deposition of the binary alloys. In all three systems, the Faradaic efficiency was higher than 88%, the rate of Zn deposition was heavily influenced by mass-transport limitation at high applied current densities, and the deposition was of anomalous type. For each applied current density, the concentrations of Ni and Fe in the ternary alloy were higher than the corresponding concentrations in the binary alloys. The hardness of Zn-Ni coatings was the highest, while that of Zn-Fe coatings was the lowest. The Zn-Ni-Fe coatings were the smoothest, had distinguished surface morphology, and contained ZnO in the bulk, not just on the surface. The lowest corrosion rate in each alloy system (214, 325 and 26?m year-1 for Zn-Ni, Zn-Fe and Zn-Ni-Fe, respectively) was characteristic of coatings deposited at 30, 30 and 40mAcm-2, respectively. The higher corrosion resistance of the ternary alloy was also reflected by a higher corrosion potential, a higher impedance and a higher slope of the Mott-Schottky line. The enhanced corrosion behavior of the ternary alloy was thus attributed to its chemical composition, phase content, roughness and the synergistic effect of Ni and Fe on the n-type semiconductor surface film. © 2010 Elsevier B.V.Item Wetting behaviour and evolution of microstructure of Sn-Ag-Zn solders on copper substrates with different surface textures(ASTM International, 2011) Satyanarayan, S.; Prabhu, K.N.The effect of surface roughness on wetting behaviour and evolution of microstructure of two lead-free solders (Sn-2.625Ag-2.25Zn and Sn-1.75Ag-4.5Zn) on copper substrate was investigated. Both solders exhibited good wettability on copper substrates having rough surface and lower wettabilty on smooth surfaces. The contact angles of solders decreased linearly with increase in surface roughness of the substrate. The exponential power law, ?=exp(-KT -1), was used to model the relaxation behaviour of solders. A high intermetallic growth was observed at the interface particularly on copper substrates with rough surface texture. A thin continuous interface showing scallop intermetallic compounds (IMC) was obtained on smooth surfaces. With an increase in surface roughness, the IMC morphology changed from scallop shaped to needle type at the Sn-2.625Ag-2.25Zn solder/ substrate interface and nodular to plate like IMCs for Sn-1.75Ag-4.5Zn solder matrix. Copyright © 2010 by ASTM International.Item Reactive wetting of Sn-2.5Ag-0.5Cu solder on copper and silver coated copper substrates(Springer Science and Business Media, LLC, 2013) Prabhu, K.In the present work, wetting characteristics and morphology of intermetallic compounds (IMCs) formed between Sn-2.5Ag-0.5Cu lead-free solder on copper (Cu) and silver (Ag) coated copper substrates were compared. It was found that, Ag coated Cu substrate improved the wettability of solder alloy. The average values of contact angles of solder alloy solidified on Ag coated Cu substrate were reduced to about 50 % as compared to contact angles obtained on Cu substrates. Flow restrictivity for spreading of solder on Ag coated Cu was found to be lower as compared to Cu substrate. The spreading of solder alloy on Ag coated Cu exhibited halo zone. Coarse needle shaped Cu6Sn 5 IMCs were observed at the solder/Cu substrate interface whereas at the solder/Ag coated Cu interface Cu6Sn5 IMCs showed scallop morphology. The formation of Cu3Sn IMC was observed for the spreading of solder alloy on both substrates. The solder/Ag coated Cu substrate interface exhibited more particulates of Ag3Sn precipitates as compared to solder/Cu substrate interface. The improved wettability of solder alloy on Ag coated Cu substrate is due to the formation of scallop IMCs at the interface. © Springer Science+Business Media New York 2012.Item Analysis of surface roughness and hardness in titanium alloy machining with polycrystalline diamond tool under different lubricating modes(Universidade Federal de Sao Carlos, 2014) Revankar, G.D.; Shetty, R.; Rao, S.S.; Gaitonde, V.N.The present work deals with the investigation on machining of difficult-to-machine material titanium alloy (Ti-6Al-4V) using poly crystalline diamond (PCD) tool under different coolant strategies, namely dry, flooded and MQL. Taguchi technique has been employed and the optimization results indicated that MQL lubricating mode with cutting speed of 150 m/min, feed rate of 0.15 mm/rev, nose radius of 0.6 mm and 0.25 mm depth of cut is necessary to minimize surface roughness and dry mode with cutting speed of 150 m/min, feed rate of 0.15 mm/rev, nose radius of 0.6 mm and 0.75 mm depth of cut is necessary to maximize surface hardness. The results indicate the substantial benefit of the minimum quantity of lubrication (MQL) and justify PCD inserts to be the most functionally satisfactory commercially available cutting tool material for machining titanium alloys for better surface finish and hardness.Item Effect of electrode material in wire electro discharge machining characteristics of Ti50Ni50-xCux shape memory alloy(Elsevier Inc. usjcs@elsevier.com, 2015) Manjaiah, M.; Narendranath, S.; Basavarajappa, S.; Gaitonde, V.N.Abstract TiNiCu alloy belongs to new class of shape memory alloy (SMA), which exhibits superior properties like shape memory effect, super elasticity and reversible martensitic transformation phase and thus find broad applications in actuators, micro tools and stents in biomedical components. Even though, SMA demonstrates outstanding property profile, traditional machining of SMAs is fairly complex and hence non-traditional machining like wire electric discharge machining (WEDM) has been performed. Hence, there is a need to investigate the WEDM performance characteristics of shape memory alloys due to excellent property profile and potential applications. In the present investigation, various machining characteristics like material removal rate (MRR), surface roughness, surface topography and metallographic changes have been studied and the influence of wire material on TiNiCu alloy machining characteristics has also been evaluated through ANOVA. Ti50Ni50-xCux=10, 20 was prepared by vacuum arc melting process. The proposed alloy as-cast material exhibits austenite property (B2 phase) and having higher hardness when compared to TiNi alloy. The investigation on WEDM of Ti50Ni50-xCux alloy reveals that the machining parameters such as servo voltage, pulse on time and pulse off time are the most significant parameters affecting MRR as well as surface roughness using both brass and zinc coated brass wires. However, machining with zinc coated brass wire yields reduced surface roughness and better MRR and also produces less surface defects on the machined surface of Ti50Ni50-xCux alloys. © 2015 Elsevier Inc. All rights reserved.Item Effect of Reflow Time on Wetting Behavior, Microstructure Evolution, and Joint Strength of Sn-2.5Ag-0.5Cu Solder on Bare and Nickel-Coated Copper Substrates(Springer New York LLC barbara.b.bertram@gsk.com, 2016) Sona, M.; Prabhu, K.N.The effect of reflow time on wetting behavior of Sn-2.5Ag-0.5Cu lead-free solder on bare and nickel-coated copper substrates has been investigated. The solder alloy was reflowed at 270°C for various reflow times of 10 s, 100 s, 300 s, and 500 s. On bare copper substrate, the intermetallic compound (IMC) thickness increased with increase in reflow time, whereas on Ni-coated Cu substrate, the IMC thickness increased up to 300 s followed by a drop for solder alloy reflowed for 500 s. The spreading behavior of the solder alloy was categorized into capillary, gravity (diffusion), and viscous zones. Gravity zone was obtained from 3.8 ± 0.43 s to 38.97 ± 3.38 s and from 5.99 ± 0.5 s to 77.82 ± 8.84 s for the Sn-2.5Ag-0.5Cu/Cu and Sn-2.5Ag-0.5Cu/Ni/Cu system, respectively. Sn-2.5Ag-0.5Cu solder alloy was also reflowed for the period corresponding to the end of the gravity zone (40 s and 80 s on bare and Ni-coated Cu, respectively). The joint strength was maximum at reflow time of 40 s and 80 s for the Sn-2.5Ag-0.5Cu/Cu and Sn-2.5Ag-0.5Cu/Ni/Cu system, respectively. The dynamic contact angle at the end of the gravity (diffusion) zone (?gz) was found to be a better parameter compared with the stabilized contact angle (?f) to assess the effect of the wettability of the liquid solder on the microstructure and joint strength. The present investigation reveals the significance of the gravity zone in assessment of optimum reflow time for lead-free solder alloys. © 2016, The Minerals, Metals & Materials Society.Item The Effect of Wetting Gravity Regime on Shear Strength of SAC and Sn-Pb Solder Lap Joints(Springer New York LLC barbara.b.bertram@gsk.com, 2017) Sona, M.; Prabhu, K.N.The failure of solder joints due to imposed stresses in an electronic assembly is governed by shear bond strength. In the present study, the effect of wetting gravity regime on single-lap shear strength of Sn-0.3Ag-0.7Cu and Sn-2.5Ag-0.5Cu solder alloys reflowed between bare copper substrates as well as Ni-coated Cu substrates was investigated. Samples were reflowed for 10 s, Tgz (time corresponding to the end of gravity regime) and 100 s individually and tested for single-lap shear strength. The single-lap shear test was also carried out on eutectic Sn-Pb/Cu- and Sn-Pb/Ni-coated Cu specimens to compare the shear strength values obtained with those of lead-free alloys. The eutectic Sn-Pb showed significantly higher ultimate shear strength on bare Cu substrates when compared to Sn-Ag-Cu alloys. However, SAC alloys reflowed on nickel-coated copper substrate exhibited higher shear strength when compared to eutectic Sn-Pb/Ni-coated Cu specimens. All the substrate/solder/substrate lap joint specimens that were reflowed for the time corresponding to the end of gravity regime exhibited maximum ultimate shear strength. © 2017, ASM International.Item ANN and RSM modeling methods for predicting material removal rate and surface roughness during WEDM of Ti50Ni40Co10 shape memory alloy(AMSE Press 16 Avenue Grauge Blanche Tassin-la-Demi-Lune 69160, 2017) Soni, H.; Narendranath, S.; Ramesh, M.R.Present study exhibits the comparison between experimental and predicted values. Where response surface method (RSM) and artificial neural network (ANN) were used as predictor for the prediction of wire electro discharge machining (WEDM) responses such as the material removal rate (MRR) and surface roughness (SR) during the machining of Ti50Ni40Co10 shape memory alloy. It has been noticed from the literature survey that pulse on time and servo voltage are most important process parameters for the machining of TiNiCo shape memory alloy, hence there are five levels of these process parameters were chosen for the present study. For the present study selected alloy has been developed through vacuum arc melting and L-25 orthogonal array has been created by using Taguchi design of experiment (DOE) for experimental plan. During the present study ANN predicted values have been found to very close to experimental values compare to RSM predicted values, hence it can be say that ANN predictor gives more accurate values compare to RSM predicted values. © 2017 AMSE Press. All rights reserved.Item Investigation on material removal rate, surface and subsurface characteristics in wire electro discharge machining of Ti50Ni50-xCux shape memory alloy(SAGE Publications Ltd info@sagepub.co.uk, 2018) Manjaiah, M.; Narendranath, S.; Basavarajappa, S.; Gaitonde, V.TiNiCu shape memory alloys have superior properties as compared with NITINOL due to their greater ductility, reduced hysteresis temperature range, and quick actuation response. The present article investigates the surface and subsurface modifications occurring due to wire electro discharge machining of Ti50Ni50-xCux shape memory alloy. The machining experiments were performed considering the pulse on time, pulse off time, and servo voltage as the process parameters. The influence of these parameters was studied on the material removal rate, surface roughness, recast layer thickness, microhardness, and phase changes in the machined surface. Longer pulse on time causes greater discharge energy, hence leading to higher material removal rate, surface roughness, and recast layer thickness. The machined surface hardness increased up to 900 Hv, which is about 59% increase with respect to the base material for longer pulse on time due to the recast layer thickness and the formation of oxides. A phase change on the machined surface was observed to cause the shape recoverability of the alloy. The microstructure, composition through EDAX, and the phase changes of the machined surface are also discussed in the article. © 2015, © IMechE 2015.