Faculty Publications

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Subject: search.filters.subject.Electronics cooling

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    Numerical analysis of multiple phase change materials based heat sink with angled thermal conductivity enhancer
    (Elsevier Ltd, 2022) Nedumaran, M.; Gnanasekaran, G.; Hooman, K.
    Phase change materials (PCM) RT-28HC, RT-35HC, and RT-44HC with three different melting temperatures, 29 °C, 36 °C, and 44 °C, with similar thermal properties, are considered. The PCM is oriented from the left to right side of the heat sink in its increasing order. The fins are attached to the heat sink longitudinally, and its orientation effects are studied low (100–500 W/m2) and high (1000–5000 W/m2) heat fluxes applied on the horizontal bottom surface of the heat sink. A 2D model is developed using ANSYS Fluent 19, and the fin orientation effects are investigated numerically. The orientation of fins at different angles such as 0°, +15°, +30°, +45°, +60°,-15°,-30°,-45°, −60° are considered. The effect of fins on the charging cycle is assessed by comparing a single and double PCM heat sink. Three initial conditions are investigated by altering the initial temperature 300 K, 303 K, and 310 K. At increasing heat input, the negative angled fins possess a higher melting rate. For different initial conditions, −60° provides higher enhancement, and +60° possesses prolonged melting for almost all cases. The performance of a triple PCM design is compared with single and double PCM counterparts under similar conditions. © 2022 The Authors
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    Multi-Objective Optimization of Hybrid Heat Sinks with Phase Change Materials
    (Taylor and Francis Ltd., 2024) Nedumaran, M.S.; Trilok, G.; Gnanasekaran, N.; Hooman, K.
    A passive method with phase change material (PCM) is an appropriate technique in electronic cooling. But, due to its poor thermal conductivity, many enhancers are employed to reduce the thermal resistance offered by the PCM. A partial filling strategy to reduce the cost and weight of foams with fins is used in this study. A hybrid heat sink with a combination of fins placed at the sidewalls of the enclosure and foams filled at certain heights such as 10, 20, and 30 mm is considered in this present work. A two-dimensional numerical model with n-eicosane as PCM is developed in ANSYS Fluent 19. A multi-objective optimization is carried out using a reliable multi criteria decision making approach. Different weightage is distributed to the objective functions in this method depending on the choice of the user. The pore size and density vary for various filling heights, and 60 cases are investigated for both charging and discharging cycles. The pore size of 0.8-0.95 and pore density of 5-25 pores per inch with a broad range is considered. From the discussions, guidelines for selecting a preferable pore size and pore density can be determined based on the filling height and applied weightage. © 2023 Taylor & Francis Group, LLC.
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    Numerical Investigation to Analyze the Effect of Various Operating Parameters on the Thermal Characteristics of Heat Pipe
    (John Wiley and Sons Inc, 2025) Jose, J.; Sutheesh, P.M.; Bandaru, B.; Gumtapure, V.; Hotta, T.K.
    The heat pipe is one of the prime candidates in electronic thermal management due to its higher thermal performance and passive nature. The present study aims to develop a 3D mathematical model to simulate the thermal behavior of the heat pipe of length 380 mm under different operating conditions. Steady-state numerical simulations are performed to predict the effect of heat inputs (in the range of 10–50 W), the coolant flow rates (40 LPH, 25 LPH, and 10 LPH), and the coolant inlet temperatures (298.15, 293.15, and 288.15 K) on the heat pipe's thermal characteristics. The analysis reveals that by increasing the heat input from 10 to 50 W, the heat pipe's thermal resistance is reduced by 49.23%, with the same amount of augmentation in its evaporator heat transfer coefficient. The cooling water flow rate also significantly impacted the heat pipe's thermal resistance and heat transfer coefficient. The evaporator heat transfer coefficient decreased by 2.01% at 25 LPH compared to 10 LPH and increased by 1.68% at 40 LPH compared to 25 LPH. Additionally, with the increase in the cooling water inlet temperature from 288.15 K to 293.15 K, the heat pipe's evaporator heat transfer coefficient increased by 7.55%, and thermal resistance was reduced by 6.02%. This confirms the vivid influence of the input thermal energy and cooling water inlet temperature on the heat pipe's thermal characteristics, while the cooling water Reynolds number (flow rate) had a minimal influence on its operating conditions. Hence, this comprehensive analysis of using the heat pipe offers valuable insight for improving heat dissipation and thermal management in electronic devices. © 2025 Wiley Periodicals LLC.