Faculty Publications

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    Integrated microchannel cooling for densely packed electronic components using vanadium pentaoxide (V2O5)-xerogel nanoplatelets-based nanofluids
    (Springer Science and Business Media B.V., 2023) Narendran, G.; Gnanasekaran, N.; Arumuga Perumal, D.A.; Moolayadukkam, M.; Nagaraja, H.S.
    The present study reports the implementation of novel nanoplatelets-based vanadium pent oxide (V2O5)-xerogel for the application of conjugate cooling in densely packed electronic devices. An integrated heat sink is made up of copper with a channel width of 490 µm and is shrink-fitted into aluminium block that acts as a heat spreader. V2O5-xerogel is synthesized by melt quenching process and characterized based on field emission scanning electron microscope, transmission electron microscope, and X-ray diffraction to analyse the surface morphology of the particles. Studies related to the stability of the nanofluids for different concentrations are discussed in this paper. Furthermore, a study on the effect of pulsating flow in microchannel is performed for different flow rates. As a result, a maximum enhancement of 17% in heat transfer coefficient was observed for the concentration of 0.4 mass% with a flow rate of 200 mL min-1 compared to a pure fluid. Finally, the results reveal that the xerogel is a potential working fluid for heat transfer applications involving microscale devices. © 2023, Akadémiai Kiadó, Budapest, Hungary.
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    Thermal studies of a MEMS-based pressure sensor for aerospace applications
    (John Wiley and Sons Inc, 2025) Krishna, B.G.; Murthy, K.R.; Khan, K.Z.; Madav, V.; Ashok Babu, T.P.
    The main objective of this study is to enhance heat transfer for the reduction of temperature in MEMS-based piezoresistive high-temperature pressure sensors. The main parameter that affects the sensor performance especially for Aerospace applications is higher operating temperature because there are many electronic components and devices that may fail due to higher temperatures. Prevention of overheating of the electronic components in the sensor is a challenge; hence, the study of heat transfer from hydraulic fluid is of utmost importance. Different types of fin surfaces to enhance the heat transfer rate are studied using ANSYS CFD (computational fluid dynamics). CFD simulations and experiments are carried out to design novel high operating temperature pressure sensors for aerospace applications. This in turn improves performance due to internal thermo-piezoresistive amplification. In this paper, high-temperature pressure sensors are designed by CFD analyses and experimentally analyzed for a better understanding of the distribution of temperature in the pressure sensor and thermal variation in the sensor and observe the changes during analysis. Extended fin surface concepts are introduced for better heat transfer and to reduce the fluid temperature inside the sensor that is transferred to the electronic components. ANSYS CFD analysis is carried out to determine the temperature distribution and two models are identified for experimental validation. © 2024 Wiley Periodicals LLC.