Faculty Publications

Now showing 1 - 4 of 4

Accurate Performance Analysis of 3D Mesh Network on Chip Architectures
(Institute of Electrical and Electronics Engineers Inc., 2018) Halavar, B.; Talawar, B.
With the increase in number and complexity of cores and components in CMPs and SoCs, a highly structured and efficient on-chip communication network is required to achieve high-performance and scalability. Network on Chips(NoC) emerged as the reliable communication framework in CMPs and SoCs. Many 2-D NoC architectures have been proposed for efficient on-chip communication. In this paper, we explore the design space of 3D NoCs using floorplan driven wire lengths and link delay estimation. We analyse the performance and cost of 2D and two 3D variants of the Mesh topology by injecting two synthetic traffic pattern for varying buffer space and floorplan based delays were considered to for the experiments. Results of our experiments show that for the injection rates from 0.02 to 0.2 the average network latency of a 4layer 3D Mesh is reduced up to 54% compared to its 2D counterpart. The on chip communication performance improved up to 2.2Ã— and 3.1Ã— in 4-layer 3D Mesh compare to 2D Mesh with uniform and transpose traffic patterns respectively. Â© 2018 IEEE.
Extending BookSim2.0 and HotSpot6.0 for power, performance and thermal evaluation of 3D NoC architectures
(Elsevier B.V., 2019) Halavar, B.; Pasupulety, U.; Talawar, B.
With the increase in number and complexity of cores and components in Chip-Multiprocessors (CMP) and Systems-on-Chip (SoCs), a highly structured and efficient on-chip communication network is required to achieve high-performance and scalability. Network-on-Chip (NoC) has emerged as a reliable communication framework in CMPs and SoCs. Many 2-D NoC architectures have been proposed for efficient on-chip communication. Cycle accurate simulators model the functionality and behaviour of NoCs by considering micro-architectural parameters of the underlying components to estimate performance, power and energy characteristics. Employing NoCs in three-dimensional integrated circuits (3D-ICs) can further improve performance, energy efficiency, and scalability characteristics of 3D SoCs and CMPs. Minimal error estimation of energy and performance of NoC components is crucial in architecture trade-off studies. Accurate modeling of re:Horizontal and vertical links by considering micro-architectural and physical characteristics reduces the error in power and performance estimation of 3D NoCs. Additionally, mapping the temperature distribution in a 3D NoC reduces estimation error. This paper presents the 3D NoC modelling capabilities extended in two existing state-of-the-art simulators, viz., the 2D NoC Simulator - BookSim2.0 and the thermal behaviour simulator - HotSpot6.0. With the extended 3D NoC modules, the simulators can be used for power, performance and thermal measurements through micro-architectural and physical parameters. The major extensions incorporated in BookSim2.0 are: Through Silicon Via power and performance models, 3D topology construction modules, 3D Mesh topology construction using variable X, Y, Z radix, tailored routing modules for 3D NoCs. The major extensions incorporated in HotSpot6.0 are: parameterized 2D router floorplan, 3D router floorplan including Through Silicon Vias (TSVs), power and thermal distribution models of 2D and 3D routers. Using the extended 3D modules, performance (average network latency), and energy efficiency metrics (Energy-Delay Product) of variants of 3D Mesh and 3D Butterfly Fat Tree topologies have been evaluated using synthetic traffic patterns. Results show that the 4-layer 3D Mesh is 2.2 × better than 2-layer 3D Mesh and 4.5 × better than 3D BFT variants in terms of network latency. 3D Mesh variants have the lowest Energy Delay Product (EDP) compared to 3D BFT variants as there is an 80% reduction in link lengths and up to 3 × more TSVs. Another observation is that the EDP of the 4-layer 3D BFT (with transpose traffic) is 1.5 × the EDP of the 4-layer 3D Mesh (with transpose traffic). Further optimizations towards a tailored 3D BFT for transpose traffic could reduce this EDP gap with the 4-layer 3D Mesh. From the 3D NoC heat maps, it was found that the edge routers in the floorplan of the tested 3D Mesh and 3D BFT topologies have the least ambient temperature. © 2019
Power and performance analysis of 3D network-on-chip architectures
(Elsevier Ltd, 2020) Halavar, B.; Talawar, B.
Emerging 3D integrated circuits(ICs) employ 3D network-on-chip(NoC) to improve power, performance, and scalability. The NoC Simulator uses the microarchitecture parameters to estimate the power and performance of the NoC. We explore the design space for 3D Mesh and Butterfly Fat Tree(BFT) NoC architecture using floorplan drive wire length and link delay estimation. The delay and power models are extended using Through Silicon Via (TSV) power and delay models. Serialization is employed to reduce the TSV area cost. Buffer space is equalised for a fair comparison between topologies. The Performance, Flits per Joules(FpJ) and Energy Delay Product(EDP) of six 2D and 3D variants of Mesh and BFT topologies (two and four layers) are analyzed by injecting synthetic traffic patterns. The 3D-4L Mesh exhibit better performance, energy efficiency (up to 4.5 × ), and EDP (up to 98 %) compared to other variants. This is because the overall length of the horizontal link is short and the number of TSVs is large (3 × ). © 2020 Elsevier Ltd
P-NoC: Performance Evaluation and Design Space Exploration of NoCs for Chip Multiprocessor Architecture Using FPGA
(Springer, 2020) Parane, K.; Prabhu Prasad, B.M.; Talawar, B.
The network-on-chip (NoC) has emerged as an efficient and scalable communication fabric for chip multiprocessors (CMPs) and multiprocessor system on chips (MPSoCs). The NoC architecture, the routers micro-architecture and links influence the overall performance of CMPs and MPSoCs significantly. We propose P-NoC: an FPGA-based parameterized framework for analyzing the performance of NoC architectures based on various design decision parameters in this paper. The mesh and a multi-local port mesh (ML-mesh) topologies have been considered for the study. By fine-tuning various NoC parameters and synthesizing on the FPGA, identify that the performance of NoC architectures are influenced by the configuration of router parameters and the interconnect. Experiments show that the flit width, buffer depth, virtual channels parameters have a significant impact on the FPGA resources. We analyze the performance of the NoCs on six traffic patterns viz., uniform, bit shuffle, random permutation, transpose, bit complement and nearest neighbor. Configuring the router and the interconnect parameters, the ML-mesh topology yields 75% lesser utilization of FPGA resources compared to the mesh. The ML-mesh topology shows an improvement of 33.2% in network latency under localized traffic pattern. The mesh and ML-mesh topologies have 0.53× and 0.1× higher saturation throughput under nearest neighbor traffic compared to uniform random traffic. © 2020, Springer Science+Business Media, LLC, part of Springer Nature.

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