Faculty Publications
Permanent URI for this communityhttps://idr.nitk.ac.in/handle/123456789/18736
Publications by NITK Faculty
Browse
74 results
Search Results
Item 3D printing of highly pure copper(MDPI AG membranes@mdpi.com, 2019) Tran, T.Q.; Chinnappan, A.; Lee, J.K.Y.; Loc, N.H.; Tran, L.T.; Wang, G.; Vijay Kumar, V.V.; Jayathilaka, W.A.D.M.; Ji, D.; Doddamani, M.; Ramakrishna, S.Copper has been widely used in many applications due to its outstanding properties such as malleability, high corrosion resistance, and excellent electrical and thermal conductivities. While 3D printing can offer many advantages from layer-by-layer fabrication, the 3D printing of highly pure copper is still challenging due to the thermal issues caused by copper’s high conductivity. This paper presents a comprehensive review of recent work on 3D printing technology of highly pure copper over the past few years. The advantages and current issues of 3D printing methods are compared while different properties of copper parts printed by these methods are summarized. Finally, we provide several potential applications of the 3D printed copper parts and an overview of current developments that could lead to new improvements in this advanced manufacturing field. © 2019 by the authors. Licensee MDPI, Basel, Switzerland.Item A simple method of characterizing local stress and local strain variation in metal working is suggested. It is an alternative to complex and time consuming visioplastic technique. A power law expression exists for hardness and strain similar to that of stress and strain. A linear expression relating hardness and stress has been estahlished. These are valid not only for pure metals but also for their alloys. © Meshap Science Publishers.(Hardness-stress-strain correlation in copper and brass through compression testing) Dharmaveera, N.; Srinivasan, K.1996Item Item The direct conversion of benzene to phenol by hydroxylation with hydrogen peroxide was carried out over catalyst containing various transition metals impregnated on activated carbon. Iron and vanadium impregnated catalysts gave better yields of phenol compared to copper impregnated catalysts. The activity of transition metals supported on activated carbon catalyst in the production of phenol was V > Fe > Cu. In addition to the role of transition metals in catalyzing the hydroxylation reaction, the hydrophobic nature of the activated carbon surface and also the surface acidity and basicity seems to have enhanced the performance of these catalysts. © 2005 Springer Science + Business Media, Inc.(Transition metals supported on activated carbon as benzene hydroxylation catalysts) Choi, J.-S.; Kim, T.-H.; Choo, K.-Y.; Sung, J.-S.; Saidutta, M.B.; Song, S.-D.; Rhee, Y.-W.2005Item Influence of austenitising temperature on the formation of strain induced martensite in austempered ductile iron(2008) Daber, S.; Ravishankar, K.S.; Prasad Rao, P.P.The present work was taken up to study the influence of austenitising temperature on the formation of strain-induced martensite in austempered ductile iron. Ductile iron containing 1.5 wt.% nickel, 0.3 wt.% molybdenum and 0.5 wt.% copper was subjected to austempering treatments which consisted of three austenitising temperatures, namely 850, 900 and 950 °C, and three austempering temperatures, namely 300, 350 and 400 °C. Tensile tests were carried out under all the heat-treatment conditions and strain-hardening behaviour was studied by applying Hollomon equation. Microstructures were studied by optical microscopy and X-ray diffraction. It was found that increasing austenitising temperature increased the tendency for the formation of strain-induced martensite at all the austempering temperatures. © 2008 Springer Science+Business Media, LLC.Item Severity of quenching and kinetics of wetting of nanofluids and vegetable oils(2009) Jagannath, V.; Prabhu, K.N.In the present work, the suitability of vegetable oil blends with mineral oil and alumina based nanofluids as quench media for industrial heat treatment was investigated. Sunflower oil, palm oil, and mineral oil were used for preparing the blends. Alumina based nanofluids of varying concentrations ranging from 0.01-4 % were used. The size of alumina particles was about 50 nm. The severity of quenching and heat transfer coefficients were estimated during quenching of copper probes. Heat transfer coefficients were estimated using a lumped heat capacitance model. The static contact angle was measured on copper substrates having a surface texture similar to the probes used for estimation of heat transfer coefficients. A dynamic contact angle analyzer was used for this purpose. The measured contact angles of nanofluids on copper were high compared to oils, indicating poor wetting by quench media that are polar in nature. Wetting characteristics had a significant effect on heat transfer coefficients estimated during quenching. Copyright © 2009 by ASTM International.Item Modelling, analysis and optimization of adsorption parameters for H3PO4 activated rubber wood sawdust using response surface methodology (RSM)(2009) Helen Kalavathy, M.H.; Iyyaswami, I.; Ganesapillai, M.G.; Miranda, L.R.Adsorption capacity of Cu2+ from aqueous solution onto H3PO4 activated carbon using rubber wood sawdust (RSAC) was investigated in a batch system. Kinetic and isotherm studies were carried out, the thermodynamic parameters like standard Gibb's free energy (?G°), enthalpy (?H°) and entropy (?S°) were evaluated. The pseudo-second-order model was found to explain the kinetics of Cu2+ adsorption most effectively. The process optimization was performed through Central Composite Rotary Design using response surface methodology (RSM) by Design Expert Version 5.0.7 (STAT-EASE Inc., Minneapolis, USA). An initial concentration of 35 mg L-1, temperature of 26 °C, carbon loading of 0.45 g (100 mL)-1, adsorption time 208 min and pH of 6.5 was found to be the optimum conditions for the maximum uptake of copper ions of 5.6 mg g-1 in batch mode. © 2009 Elsevier B.V. All rights reserved.Item Air quality assessment of Dhanbad District, India - A case study(2010) Anantharamu, A.; Singh, G.; Venkat Reddy, D.Ambient air pollution status in Dhanbad district is studied and presented in this article. The selection of Dhanbad is made considering its importance and the nature of activities taking place around the district. For the assessment of ambient air quality in Dhanbad, the following five locations were chosen: Main Gate of Indian School of Mines(ISM), Dhanbad: It is a site representing purely commercial activities and road traffic. Bankmore: It is one of the busiest marketing centres of the district and is surrounded by residential areas. All the vehicles going to Bokaro pass by this place and thus the traffic density is pretty high. Kusunda: It is a place 10.9 kilometres from Dhanbad Railway Station. It is just beside one of the coal mines, hence, all vehicles going to the mine passes through this place. Steel Gate: It consists of a small market. Trucks and other heavy vehicle are more frequent during night as this road connects to a highway. ISM Admin Block: It can be considered as a sensitive area since it is a very calm place where the usage of vehicles is minimum throughout the day. Monitoring of ambient air quality is done following the standard procedure prescribed in IS: 5182. In addition, the concentration of lead, zinc, cadmium, copper, manganese and iron metals in SPM is also monitored. The ambient air quality assessment was done in the month of June, 2009. The concentration of SPM was higher than the permissible limit in three locations namely ISM Main Gate, Bankmore and Steel Gate, while it was less than the permissible limit in other two locations, ISM Admin Block and Kusunda. Since the generation of SPM was mainly due to vehicular traffic it was expected to cross the limit in the above mentioned three locations as density of vehicular movement is very high. © 2010 CAFET-INNOVA TECHNICAL SOCIETY.Item Wetting behaviour and evolution of microstructure of Sn-Ag-Zn solders on copper substrates with different surface textures(2010) Satyanarayan, S.; Prabhu, K.N.The effect of surface roughness on wetting behaviour and evolution of microstructure of two lead-free solders (Sn-2.625Ag-2.25Zn and Sn-1.75Ag-4.5Zn) on copper substrate was investigated. Both solders exhibited good wettability on copper substrates having rough surface and lower wettabilty on smooth surfaces. The contact angles of solders decreased linearly with increase in surface roughness of the substrate. The exponential power law, ?=exp(-K ?n), was used to model the relaxation behaviour of solders. A high intermetallic growth was observed at the interface particularly on copper substrates with rough surface texture. A thin continuous interface showing scallop intermetallic compounds (IMC) was obtained on smooth surfaces. With an increase in surface roughness, the IMC morphology changed from scallop shaped to needle type at the Sn-2.625Ag-2.25Zn solder/substrate interface and nodular to plate like IMCs for Sn-1.75Ag-4.5Zn solder matrix. Copyright © 2010 by ASTM International.Item Wetting behaviour and evolution of microstructure of Sn-Ag-Zn solders on copper substrates with different surface textures(ASTM International, 2011) Satyanarayan, S.; Prabhu, K.N.The effect of surface roughness on wetting behaviour and evolution of microstructure of two lead-free solders (Sn-2.625Ag-2.25Zn and Sn-1.75Ag-4.5Zn) on copper substrate was investigated. Both solders exhibited good wettability on copper substrates having rough surface and lower wettabilty on smooth surfaces. The contact angles of solders decreased linearly with increase in surface roughness of the substrate. The exponential power law, ?=exp(-KT -1), was used to model the relaxation behaviour of solders. A high intermetallic growth was observed at the interface particularly on copper substrates with rough surface texture. A thin continuous interface showing scallop intermetallic compounds (IMC) was obtained on smooth surfaces. With an increase in surface roughness, the IMC morphology changed from scallop shaped to needle type at the Sn-2.625Ag-2.25Zn solder/ substrate interface and nodular to plate like IMCs for Sn-1.75Ag-4.5Zn solder matrix. Copyright © 2010 by ASTM International.
