Faculty Publications

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Subject: search.filters.subject.Contact heat transfer

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    Inverse modeling of heat transfer with application to solidification and quenching
    (2002) Prabhu, K.N.; Ashish, A.A.
    The inverse modeling of heat transfer involves the estimation of boundary conditions from the knowledge of thermal history inside a heat conducting body. Inverse analysis is extremely useful in modeling of contact heat transfer at interfaces of engineering surface during materials processing. In the present work, the one-dimensional transient heat conduction equation was inversely modeled in both cartesian as well as cylindrical coordinates. The model is capable of estimating heat flux transients, chill surface temperature, and total heat flow from the source to the sink for an input of thermal history inside the sink. The methodology was adopted to solve boundary heat transfer problems inversely during solidification and quenching. The response of the inverse solution to measured sensor data was studied by carrying out numerical experiments involving the use of varying grid size and time steps, future temperatures, and regularization techniques.
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    Effect of chemical modification of Al-Si alloys on thermal diffusivity and contact heat transfer at the casting-chill interface
    (2012) Prabhu, K.N.; Jayananda; Hegde, S.
    The heat flow during the unidirectional downward solidification of Al-7Si and Al-12Si alloys was analyzed using thermal analysis technique and inverse modeling. Chills instrumented with thermocouples were brought into contact with a small pool of liquid metal so as to minimize the effect of convection caused by pouring and temperature gradients. Modification melt treatment resulted in an increase in the cooling rate of the solidifying casting near the casting-chill interfacial region. The corresponding interfacial heat flux transients were also found to be higher. The thermal diffusivities of alloys were measured using a laser pulse technique and were found to be higher for modified alloys. However, the increase in the heat flux transients was attributed mainly to the improvement in the casting-chill interfacial thermal contact condition brought about by the decrease in the surface tension of the liquid metal upon the addition of sodium. Copyright © 2012 by ASTM International.
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    The effect of load and addition of MWCNTs on silicone based TIMs on thermal contact heat transfer across Cu/Cu interface
    (Institute of Physics Publishing helen.craven@iop.org, 2019) Pathumudy, R.; Narayanprabhu, K.
    In the present work, the effect of thermal interface material (TIM) and load on contact heat transfer between hot and cold cylindrical copper specimens was assessed. Pristine silicone grease and multi walled carbon nanotubes (MWCNT) impregnated silicone grease was used as TIM. Copper specimens with L/D ratios of 1 and 5 were used. For copper specimens with L/D ratio of 1, the interfacial heat transfer was quantified by estimating the peak heat flux and integral heat flow using a lumped heat capacitance approach. An inverse solution to heat conduction equation was adopted for estimating heat flux transients for copper specimens with L/D ratio of 5. As the applied load increased from a no load condition to 5 kg, the peak heat flux and the corresponding integral flow increased significantly. Increasing the load above 5 kg did not result in any significant changes in the peak heat flux and integral heat flow for both sets of specimens. The effect of load on the contact heat transfer was significant in the absence of TIM. The use of 0.1 wt% MWCNT- silicone grease as TIM significantly increased the heat flow for no load condition. At higher loads, the effect of MWCNT was insignificant and caused deterioration in the heat flow parameters. Further, increasing the MWCNT content to 1 wt% in silicone grease decreased the heat flux transients at all loading conditions. The thermal contact resistance (RT) was calculated and it increased exponentially with the peak temperature difference (?Tmax) between hot and cold specimens irrespective of the L/D ratio. © 2019 IOP Publishing Ltd.