Faculty Publications
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Item Wettability and bond shear strength of Sn-9Zn lead-free solder alloy reflowed on copper substrate(Trans Tech Publications Ltd ttp@transtec.ch, 2015) Tikale, S.; Sona, M.; Prabhu, K.Lead-free solders are environment friendly and are in great demand for microelectronic applications. In the present study, Sn-9Zn lead free solder alloy was solidified on Cu substrate for different reflow times varying from 10 to 1000s. The influence of reflow time on wetting, bond shear strength and formation of intermetallic compounds (IMCs) was studied using dynamic contact angle analyzer, bond tester and scanning electron microscopy (SEM), respectively. The results indicate that, the wettability of the solder alloy increased with increase in reflow time. Microstructure study revealed the presence of Cu5Zn8 and CuZn5 IMCs at the interface. The thickness of an IMC increased with increase in the reflow time. A mean thickness of Cu5Zn8 IMC layer of about 11μm was obtained for a reflow time of 1000s. The thickness of CuZn5 layer increased up to a reflow time of 100s and decreased thereafter. The bond shear strength increased up to 100s and decreased with increase in reflow time. The decrease in shear strength at higher reflow time is mainly due to the formation of thick Cu5Zn8 IMC layer and diffusion of Sn from bulk solder towards the substrate. The thick IMC layer exhibited micro-cracks leading to the brittle failure of bond under the influence of shear stress. © (2015) Trans Tech Publications, Switzerland.Item Effect of cooling rate on joint shear strength of Sn-9Zn lead-free solder alloy reflowed on copper substrate(ASTM International, 2017) Tikale, S.; Sona, M.; Prabhu, K.Reliability of the solder joint largely depends on mechanical strength, fatigue resistance, coefficient of thermal expansion, and intermetallic compound formation. Cooling rate significantly affects the physical properties of an alloy and influences the mechanical behavior of solder joints. In the present study, Sn-9Zn lead-free solder alloy was solidified on Cu substrate under furnace cooling (0.04°C/s), air cooling (0.16°C/s), and water cooling (94°C/s) conditions. The effect of varying cooling rates on the intermetallic compound (IMC) formation at the interface and the resulting joint shear strength was studied. A microstructure study revealed the presence of Cu5Zn8 and CuZn5 intermetallic compounds at the solder-substrate interface. The IMC layer thickness at the interface increased with a decrease in the cooling rate. The joint shear strength increased with an increase in the cooling rate. The air and furnace cooling resulted in the formation of a thick IMC layer. The IMC obtained from the furnace cooling was associated with micro-cracks leading to a decrease in the joint shear strength. © Copyright 2017 by ASTM International.Item Effect of Multiple Reflow Cycles and Al2O3 Nanoparticles Reinforcement on Performance of SAC305 Lead-Free Solder Alloy(Springer New York LLC barbara.b.bertram@gsk.com, 2018) Tikale, S.; Prabhu, K.N.The effect of Al2O3 nanoparticles reinforcement on melting behavior, microstructure evolution at the interface and joint shear strength of 96.5Sn3Ag0.5Cu (SAC305) lead-free solder alloy subjected to multiple reflow cycles was investigated. The reinforced SAC305 solder alloy compositions were prepared by adding Al2O3 nanoparticles in different weight fractions (0.05, 0.1, 0.3 and 0.5 wt.%) through mechanical dispersion. Cu/solder/Cu micro-lap-shear solder joint specimens were used to assess the shear strength of the solder joint. Differential scanning calorimetry was used to investigate the melting behavior of SAC305 solder nanocomposites. The solder joint interfacial microstructure was studied using scanning electron microscopy. The results showed that the increase in melting temperature (TL) and melting temperature range of the SAC305 solder alloy by addition of Al2O3 nanoparticles were not significant. In comparison with unreinforced SAC305 solder alloy, the reinforcement of 0.05-0.5 wt.% of Al2O3 nanoparticles improved the solder wettability. The addition of nanoparticles in minor quantity effectively suppressed the Cu6Sn5 IMC growth, improved the solder joint shear strength and ductility under multiple reflow cycles. However, the improvement in solder properties was less pronounced on increasing the nanoparticle content above 0.1 wt.% of the solder alloy. © 2018, ASM International.Item Effect of Multiple Reflow Cycles on the Shear Strength of Nano-Al2O3 Particles Reinforced Sn3.6Ag Lead-Free Solder Alloy(Springer, 2018) Tikale, S.; Prabhu, K.N.The effect of nano-Al2O3 particles reinforcement on shear strength of Sn3.6Ag solder joint exposed to multiple reflows was studied. The nano-composites of Sn3.6Ag solder were developed by mechanical dispersion of nanoparticles in the solder alloy. The melting, mechanical and microstructural properties of Sn3.6Ag composite solders with varying weight fractions of nano-Al2O3 particles were evaluated by subjecting them to multiple reflow cycles. The results showed an improvement in the wettability of the solder with inclusion of nano-Al2O3 particles. The composite Sn3.6Ag solders with 0.01–0.05 wt% nanoparticles reinforcement showed an improvement in the shear strength and ductility of the solder joint compared to monolithic solder alloy under multiple reflow cycles. Samples doped with 0.05 wt% nanoparticles and reflowed for two reflow cycles displayed an appreciable suppression in interfacial intermetallic compound’s growth and improvement in the solder joint shear strength. The addition above 0.1 wt% in solder showed a decrease in the beneficial effects of nano-Al2O3 particles reinforcement. © 2018, The Indian Institute of Metals - IIM.Item Assessment of the Performance of Sn–3.5Ag/Cu Solder Joint Under Multiple Reflows, Thermal Cycling and Corrosive Environment(Springer, 2018) Samuel, A.; Tikale, S.; Prabhu, K.N.The solder joint performance of Sn–3.5Ag/Cu combination was studied under multiple reflows, thermal cycling and exposure to the corrosive environment. Factorial experiment was carried out to assess the effect of individual parameters and the interaction of parameters on the shear strength of the solder joint. The results showed that the combination of thermal cycling and immersion in corrosive media resulted in the maximum decrease in the shear strength followed by the combination of multiple reflows and corrosive media. The shear strength reduced with the increase in immersion duration in corrosion medium. Factorial experiment was analyzed using analyis of variance (ANOVA). The results indicated that the individual parameters had a significant effect, whereas the effect of interaction of these parameters was less significant on the performance of the solder joint. Fracture surface indicated mixed mode of failure and the occurrence of fracture predominantly in the bulk solder. © 2018, The Indian Institute of Metals - IIM.Item Performance of MWCNT-Reinforced SAC0307/Cu Solder Joint Under Multiple Reflow Cycles(Springer, 2018) Tikale, S.; Prabhu, K.N.The evolution of interfacial microstructure and its effect on shear strength under multiple reflow cycles for multi-walled carbon nanotubes (MWCNT)-reinforced Sn0.3Ag0.7Cu solder/copper joint was investigated. The melting characteristics, wettability and mechanical properties of the solder alloy were assessed. The addition of MWCNT in the range of 0.01–0.05 wt% improved the wettability, melting behaviour and mechanical strength of the SAC0307 solder alloy. The nanoparticles in small weight fraction (0.01–0.05 wt%) addition were more effective in retarding intermetallic compounds growth at the interface. Amongst all compositions studied, the SAC0307–0.05MWCNT nanocomposite showed significant improvement in the performance of SAC0307/Cu solder joint under multiple reflow condition. The nanoparticles’ reinforcement above 0.1 wt% of the solder alloy was ineffective in improving the solder performance due to increased clustering in the matrix. © 2018, The Indian Institute of Metals - IIM.Item The effect of multi-walled carbon nanotubes reinforcement and multiple reflow cycles on shear strength of SAC305 lead-free solder alloy(ASTM International, 2019) Tikale, S.; Prabhu, N.In this study, the effect of multi-walled carbon nanotubes (MWCNT) reinforcement on joint shear strength and microstructural development of tin-3.0silver-0.5copper (SAC305)/ copper solder joint subjected to multiple reflow cycles was investigated. The MWCNT-reinforced SAC305 solder systems (SAC305-x MWCNT; x = 0.01, 0.05, 0.1, and 0.5 wt.%) were developed by a mechanical dispersion method. The microstructural, mechanical, and melting properties of SAC305 composite solders were evaluated as a function of different wt.% of MWCNT addition. The melting behavior of composite solders was analyzed using differential scanning calorimetry. The morphology and intermetallic compound growth at the solder joint interface were studied using scanning electron microscopy. The copper/solder/ copper micro-lap-shear solder joint specimens reflowed for multiple reflow cycles were systematically characterized to evaluate the joint shear strength. The results showed that the reinforcement in the range of 0.01-0.05 wt.% of MWCNT resulted in the improvement of joint shear strength and better wettability compared to plain SAC305 solder alloy. Amongst all compositions analyzed, SAC305-0.05MWCNT nanocomposite suppressed the intermetallic compound layer growth effectively leading to improvement in the joint shear strength under multiple reflow cycles. © 2019 by ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959Item Wettability, Interfacial Intermetallic Growth and Joint Shear Strength of Eutectic Sn–Cu Solder Reflowed on Bare and Nickel-Coated Copper Substrates(Springer, 2019) Sona, M.; Tikale, S.; Prabhu, N.In the present study, wettability, interfacial intermetallic growth and shear strength of Sn–Cu eutectic solder solidified on bare as well as nickel-coated copper substrates were examined. Sn–0.7Cu solder was reflowed over the substrate for reflow times ranging from 10 to 500 s at 270 °C. Samples were cooled by quenching in water. The wetting behavior was similar on both the substrates. The corresponding time period to the end of gravity zone (Tgz) was measured from the relaxation curve obtained from wetting studies. Tgz was found to be 25 s for Sn–0.7Cu on bare and 50 s on Ni-coated copper substrates. The intermetallic compound layer thickness was fitted to a growth model to study the growth kinetics. The integrity of solder/substrate joint was assessed by performing ball as well as single-lap joint shear tests. The shear strength was found to be maximum at Tgz for all solder/substrate systems. © 2019, The Indian Institute of Metals - IIM.Item The effect of reflow temperature on time at the end of gravity zone (TGZ) of Sn-3.8Ag-0.7Cu solder alloy(ASTM International, 2020) Panikar, R.S.; Amogha Skanda, V.; Tikale, S.; Prabhu, K.N.The reflow time for solder until the end of the gravity zone (Tgz) is considered to be the optimum reflow time for obtaining high mechanical performance from lead-free solders. In the present work, the effect of reflow time and temperature on Tgz of Sn-3.8Ag-0.7Cu (SAC387) lead-free solder alloy reflowed on the copper substrate has been investigated. The evolution of interfacial microstructure and solder bond shear strength under different reflow temperatures and time was assessed. Solder balls weighing 0.08 ± 0.01 g were reflowed at 260°C, 280°C, and 300°C for reflow times of 30 s, 60 s, 120 s, and 240 s. Times at the end of the gravity zone for SAC387 solder were obtained as 110 ± 5 s, 55 ± 5 s, and 23 ± 3 s for reflow temperatures of 260°C, 280°C and 300°C, respectively. The contact angle for SAC387 solder on the copper substrate at Tgz was found to be 25.5° ± 0.2° for all reflow temperatures. Scanning electron microscopy revealed the formation of a Cu6Sn5 intermetallic compound (IMC) layer at the interface. The IMC layer thickness increased with increase in reflow temperature and time. Maximum solder joint strength was obtained at Tgz reflow times for all reflow temperatures. Microstructures of samples reflowed beyond the gravity zone showed secondary Cu6Sn5 precipitation in the solder bulk. The present investigation reveals a reduction in Tgz reflow time for SAC387 lead-free solder at higher operating reflow temperatures. © © 2020 by ASTM InternationalItem Development of low-silver content SAC0307 solder alloy with Al2O3 nanoparticles(Elsevier Ltd, 2020) Tikale, S.; Prabhu, K.N.The present study is focused on the development of low Ag content 99Sn-0.3Ag-0.7Cu (SAC0307) solder alloy with Al2O3 nanoparticles reinforcement. The effects of multiple reflow cycles and the addition of Al2O3 nanoparticles in 0.01, 0.05, 0.1, 0.3 and 0.5 percentages by weight on microstructure development and mechanical strength of the solcder joint were first investigated. The addition of ceramic nanoparticles in 0.01-0.5 wt% range resulted in 15-40% increase in the wetting area and about 10-55% increase in the microhardness of the solder. The shear strength of nanoparticles reinforced SAC0307 solder joint increased by 11-53% under multiple reflow conditions. Nano-composite solder joints containing 0.01 and 0.05 wt% Al2O3 nanoparticles showed superior shear strength and improved ductility for two reflow cycles. Hence, these nano-composites were selected and tested for their performance and joint reliability. The surface mount 2220 capacitor joint assemblies with the selected nano-composites reflowed on bare copper and Ni–P coated Cu substrates were investigated. The reliability of the solder joint was assessed by determining the joint shear strength under varying temperature environments. The nano-composite with 0.05 wt% nanoparticles addition resulted in maximum joint reliability compared to monolithic solder. The Ni–P coating on the Cu substrate significantly hindered the IMC growth at the joint interface under different thermal conditions. The joint strength improved by about 26% for samples reflowed on Ni–P surface finish compared to that on bare Cu metallization. The Weibull analysis of the joint shear strength under all thermal conditions suggest that the addition of Al2O3 nanoparticles in very small amounts to SAC0307 solder and the presence of Ni–P surface finish on Cu substrate significantly enhances the performance and reliability of solder joints. In terms of both quality and reliability, the newly developed low-silver content SAC0307+0.05Al2O3 nano-composite is an effective alternate lead-free solder that can be used in microelectronics industry in place of high-silver content Sn–Ag–Cu solders. © 2020 Elsevier B.V.