Faculty Publications
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Item Effect of Multiple Reflow Cycles and Al2O3 Nanoparticles Reinforcement on Performance of SAC305 Lead-Free Solder Alloy(Springer New York LLC barbara.b.bertram@gsk.com, 2018) Tikale, S.; Prabhu, K.N.The effect of Al2O3 nanoparticles reinforcement on melting behavior, microstructure evolution at the interface and joint shear strength of 96.5Sn3Ag0.5Cu (SAC305) lead-free solder alloy subjected to multiple reflow cycles was investigated. The reinforced SAC305 solder alloy compositions were prepared by adding Al2O3 nanoparticles in different weight fractions (0.05, 0.1, 0.3 and 0.5 wt.%) through mechanical dispersion. Cu/solder/Cu micro-lap-shear solder joint specimens were used to assess the shear strength of the solder joint. Differential scanning calorimetry was used to investigate the melting behavior of SAC305 solder nanocomposites. The solder joint interfacial microstructure was studied using scanning electron microscopy. The results showed that the increase in melting temperature (TL) and melting temperature range of the SAC305 solder alloy by addition of Al2O3 nanoparticles were not significant. In comparison with unreinforced SAC305 solder alloy, the reinforcement of 0.05-0.5 wt.% of Al2O3 nanoparticles improved the solder wettability. The addition of nanoparticles in minor quantity effectively suppressed the Cu6Sn5 IMC growth, improved the solder joint shear strength and ductility under multiple reflow cycles. However, the improvement in solder properties was less pronounced on increasing the nanoparticle content above 0.1 wt.% of the solder alloy. © 2018, ASM International.Item Effect of Multiple Reflow Cycles on the Shear Strength of Nano-Al2O3 Particles Reinforced Sn3.6Ag Lead-Free Solder Alloy(Springer, 2018) Tikale, S.; Prabhu, K.N.The effect of nano-Al2O3 particles reinforcement on shear strength of Sn3.6Ag solder joint exposed to multiple reflows was studied. The nano-composites of Sn3.6Ag solder were developed by mechanical dispersion of nanoparticles in the solder alloy. The melting, mechanical and microstructural properties of Sn3.6Ag composite solders with varying weight fractions of nano-Al2O3 particles were evaluated by subjecting them to multiple reflow cycles. The results showed an improvement in the wettability of the solder with inclusion of nano-Al2O3 particles. The composite Sn3.6Ag solders with 0.01–0.05 wt% nanoparticles reinforcement showed an improvement in the shear strength and ductility of the solder joint compared to monolithic solder alloy under multiple reflow cycles. Samples doped with 0.05 wt% nanoparticles and reflowed for two reflow cycles displayed an appreciable suppression in interfacial intermetallic compound’s growth and improvement in the solder joint shear strength. The addition above 0.1 wt% in solder showed a decrease in the beneficial effects of nano-Al2O3 particles reinforcement. © 2018, The Indian Institute of Metals - IIM.Item Assessment of the Performance of Sn–3.5Ag/Cu Solder Joint Under Multiple Reflows, Thermal Cycling and Corrosive Environment(Springer, 2018) Samuel, A.; Tikale, S.; Prabhu, K.N.The solder joint performance of Sn–3.5Ag/Cu combination was studied under multiple reflows, thermal cycling and exposure to the corrosive environment. Factorial experiment was carried out to assess the effect of individual parameters and the interaction of parameters on the shear strength of the solder joint. The results showed that the combination of thermal cycling and immersion in corrosive media resulted in the maximum decrease in the shear strength followed by the combination of multiple reflows and corrosive media. The shear strength reduced with the increase in immersion duration in corrosion medium. Factorial experiment was analyzed using analyis of variance (ANOVA). The results indicated that the individual parameters had a significant effect, whereas the effect of interaction of these parameters was less significant on the performance of the solder joint. Fracture surface indicated mixed mode of failure and the occurrence of fracture predominantly in the bulk solder. © 2018, The Indian Institute of Metals - IIM.Item Performance of MWCNT-Reinforced SAC0307/Cu Solder Joint Under Multiple Reflow Cycles(Springer, 2018) Tikale, S.; Prabhu, K.N.The evolution of interfacial microstructure and its effect on shear strength under multiple reflow cycles for multi-walled carbon nanotubes (MWCNT)-reinforced Sn0.3Ag0.7Cu solder/copper joint was investigated. The melting characteristics, wettability and mechanical properties of the solder alloy were assessed. The addition of MWCNT in the range of 0.01–0.05 wt% improved the wettability, melting behaviour and mechanical strength of the SAC0307 solder alloy. The nanoparticles in small weight fraction (0.01–0.05 wt%) addition were more effective in retarding intermetallic compounds growth at the interface. Amongst all compositions studied, the SAC0307–0.05MWCNT nanocomposite showed significant improvement in the performance of SAC0307/Cu solder joint under multiple reflow condition. The nanoparticles’ reinforcement above 0.1 wt% of the solder alloy was ineffective in improving the solder performance due to increased clustering in the matrix. © 2018, The Indian Institute of Metals - IIM.Item The effect of multi-walled carbon nanotubes reinforcement and multiple reflow cycles on shear strength of SAC305 lead-free solder alloy(ASTM International, 2019) Tikale, S.; Prabhu, N.In this study, the effect of multi-walled carbon nanotubes (MWCNT) reinforcement on joint shear strength and microstructural development of tin-3.0silver-0.5copper (SAC305)/ copper solder joint subjected to multiple reflow cycles was investigated. The MWCNT-reinforced SAC305 solder systems (SAC305-x MWCNT; x = 0.01, 0.05, 0.1, and 0.5 wt.%) were developed by a mechanical dispersion method. The microstructural, mechanical, and melting properties of SAC305 composite solders were evaluated as a function of different wt.% of MWCNT addition. The melting behavior of composite solders was analyzed using differential scanning calorimetry. The morphology and intermetallic compound growth at the solder joint interface were studied using scanning electron microscopy. The copper/solder/ copper micro-lap-shear solder joint specimens reflowed for multiple reflow cycles were systematically characterized to evaluate the joint shear strength. The results showed that the reinforcement in the range of 0.01-0.05 wt.% of MWCNT resulted in the improvement of joint shear strength and better wettability compared to plain SAC305 solder alloy. Amongst all compositions analyzed, SAC305-0.05MWCNT nanocomposite suppressed the intermetallic compound layer growth effectively leading to improvement in the joint shear strength under multiple reflow cycles. © 2019 by ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959Item Characterisation of Sn–3.5Ag solder/Cu joint under various reflow conditions(Taylor and Francis Ltd., 2022) Georgy, K.; Tikale, S.; Prabhu, K.N.The effect of reflow time and reflow temperatures on wettability and bond shear strength of Sn–3.5Ag solder alloy on a Cu substrate is assessed for reflow times of 10 s, 100 s, 300 s, 500 s and reflow temperatures of 250 °C, 270 °C, 290 °C, 320 °C. The wetting regime was found to have capillary, gravity, and viscous regimes. A microstructural study using a scanning electron microscope (SEM) with energydispersive spectroscopy revealed the presence of intermetallic compounds at the interface between the substrate and solder droplet. The bond strength of the solder joint is maximum at a reflow temperature of 250 °C and a reflow time of 10 s. Bond shear strength decreased with an increase in reflow time from 10 s to 500 s. The effect of different cooling conditions on the solder–substrate joint is also investigated. © 2022 Institute of Materials, Minerals and Mining.