Faculty Publications
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Item Wetting behavior and evolution of microstructure of Sn-3.5Ag solder alloy on electroplated 304 stainless steel substrates(Springer India sanjiv.goswami@springer.co.in, 2012) Nayak, V.U.; Prabhu, K.N.; Stanford, N.; Satyanarayan, S.In the present study, wetting characteristics and evolution of microstructure of Sn-3.5Ag solder on Ag/Ni and Ni electroplated 304 stainless steel (304SS) substrates have been investigated. Solder alloy spread on Ag/Ni plated 304SS substrates exhibited better wetting as compared to Ni/304SS substrate. The formations of irregular shaped and coarser IMCs were found at the interface of solder/Ni/304SS substrate region whereas, solder/Ag/Ni/substrate interface showed continuous scallop and needle shaped IMCs. The precipitation of Ag3Sn, Ni-Sn, FeSn2 and lesser percentage of Fe-Cr-Sn IMCs were found at the interface of solder/Ag/Ni/substrate region whereas, solder/Ni/304 SS substrate exhibited predominantly FeSn2 and Fe-Cr-Sn IMCs. Presence of higher amount of Fe-Cr-Sn IMCs at the solder/Ni/304SS substrate interface inhibited the further wetting of solder alloy.Item Reactive wetting, evolution of interfacial and bulk IMCs and their effect on mechanical properties of eutectic Sn-Cu solder alloy(2011) Satyanarayan, S.; Prabhu, K.N.Lead free solders are increasingly being used in electronic applications. Eutectic Sn-Cu solder alloy is one of the most favored lead free alloys used for soldering in electronic applications. It is inexpensive and principally used in wave soldering. Wetting of liquid solder on a substrate is a case of reactive wetting and is accompanied by the formation of intermetallic compounds (IMCs) at the interface. Wettability of Sn-0.7Cu solder on metallic substrates is significantly affected by the temperature and the type of flux. The wettability and microstructural evolution of IMCs at the Sn-0.7Cu solder/substrate interfaces are reviewed in the present paper. The reliability of solder joints in electronic packaging is controlled by the type and morphology of interfacial IMCs formed between Sn-0.7Cu solder and substrates. The formation and growth mechanisms of interfacial IMCs are highlighted. Mechanical behavior of bulk solder alloy and solder joint interfaces are analyzed. The characteristics of the IMCs which have marked effect on the mechanical properties and fracture behavior as well as reliability of solder joints of the alloy are discussed. An attempt has also been made to discuss the effect of cooling rate and strain rate on shear strength, tensile properties and creep resistance of the solder alloy. It is recommended that future work should focus on evolving a standard procedure involving sequential assessment of wetting behavior, evolution of IMCs and mechanical properties. © 2011 Elsevier B.V.Item Spreading behavior and evolution of IMCs during reactive wetting of SAC solders on smooth and rough copper substrates(2013) Satyanarayan, S.; Prabhu, K.The effect of surface roughness of copper substrate on the reactive wetting of Sn-Ag-Cu solder alloys and morphology of intermetallic compounds (IMCs) was investigated. The spreading behavior of solder alloys on smooth and rough Cu substrates was categorized into capillary, diffusion/reaction, and contact angle stabilization zones. The increase in substrate surface roughness improved the wetting of solder alloys, being attributed to the presence of thick Cu 3Sn IMC at the interface. The morphology of IMCs transformed from long needle shaped to short protruded type with an increase in the substrate surface roughness for the Sn-0.3Ag-0.7Cu and Sn-3Ag-0.5Cu solder alloys. However, for the Sn-2.5Ag-0.5Cu solder alloy the needle-shaped IMCs transformed to the completely scallop type with increase in the substrate surface roughness. The effect of Ag content on wetting behavior was not significant. © 2013 TMS.