Faculty Publications

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Author: search.filters.author.Prabhu, K.N.Subject: search.filters.subject.Solidification

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    Inverse modeling of heat transfer with application to solidification and quenching
    (2002) Prabhu, K.N.; Ashish, A.A.
    The inverse modeling of heat transfer involves the estimation of boundary conditions from the knowledge of thermal history inside a heat conducting body. Inverse analysis is extremely useful in modeling of contact heat transfer at interfaces of engineering surface during materials processing. In the present work, the one-dimensional transient heat conduction equation was inversely modeled in both cartesian as well as cylindrical coordinates. The model is capable of estimating heat flux transients, chill surface temperature, and total heat flow from the source to the sink for an input of thermal history inside the sink. The methodology was adopted to solve boundary heat transfer problems inversely during solidification and quenching. The response of the inverse solution to measured sensor data was studied by carrying out numerical experiments involving the use of varying grid size and time steps, future temperatures, and regularization techniques.
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    Experimental models for assessment of interfacial heat transfer in dip soldering
    (2010) Nyamannavar, S.; Prabhu, K.N.
    The success of a numerical simulation for solder solidification during soldering processes depends on an accurate knowledge of heat transfer phenomenon at the solder/substrate interface. Two experimental setups were designed to study the interfacial heat transfer at solder/substrate interface. In the first method, a cylindrical probe of substrate material was dipped in liquid solder and solder was allowed to solidify around the metal probe. In the second method the test probe was dipped in the bulk solder liquid of sufficiently large quantity and allowed to attain the surrounding solder liquid temperature. Temperature at the center of the probe was measured using thermocouple. Heat flux transients at the surface of the probe were estimated by lumped heat capacitance method. SEM study at the solder/substrate interfacial region for experiments of solidifying solder around the test probe revealed the existence of a clear gap with aluminum substrate. A conforming contact was obtained with copper substrate. The nature of heat flux transients was found to be different in two experiments. © (2010) Trans Tech Publications.
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    Assessment of heat transfer during solidification of Al-22% Si alloy by inverse analysis and surface roughness based predictive model
    (Springer India sanjiv.goswami@springer.co.in, 2012) Jayananda; Prabhu, K.N.
    Heat flux transients were estimated during unidirectional downward solidification of Al-22% Si alloy against copper, die steel and stainless steel chills. The chill instrumented with thermocouples was brought into contact with the liquid metal so as to avoid the effect of convection associated with the pouring of liquid metal. Heat flux transients were estimated by solving the inverse heat conduction problem. Higher thermal conductivity of chill material resulted in increased peak heat flux at the metal/ chill interface. Peak heat flux decreased when 100 lm thick alumina coating was applied on the chill surface. The lower thermal conductivity of alumina based coating and the presence of additional thermal resistance decreases the interfacial heat transfer. For uncoated chills, the ratio of the surface roughness (R a) of the casting to chill decreased from 6.5 to 0.5 with decrease in the thermal conductivity of the chill material. However when coating was applied on the chill, the surface roughness ratio was nearly constant at about 0.2 for all chill materials. The measured roughness data was used in a sum surface roughness model to estimate the heat transfer coefficient. The results of the model are in reasonable agreement with experimentally determined heat-transfer coefficients for coated chills.
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    Effect of thermal contact heat transfer on solidification of Pb-Sn and Pb-free solders
    (Elsevier Ltd, 2007) Chellaih, T.; Kumar, G.; Prabhu, K.N.
    The effect of thermal contact heat transfer on the solidification of spherical droplets of four solder alloys, namely, Sn-37Pb, Sn-9Zn, Sn-0.7Cu and Sn-3.5Ag, was studied using SOLIDCAST simulation package. A significant drop in the arrest time was observed for increase in heat transfer coefficient from 1000 to 2000 W/m2 K. Effect of contact conductance and thermal diffusivity of solder alloys on arrest time is quantified by the power relation, ? = m(?{symbol})n where ? and ?{symbol} are defined as arrest time and heat transfer parameters, respectively. Experiments were also carried out to investigate the effect of cooling rate on solidification behaviour of the solder alloys used in simulation. The results indicated the significant effect of mould material on interfacial heat flux and metallurgical microstructure. © 2005 Elsevier Ltd. All rights reserved.
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    Heat transfer and solidification behaviour of modified A357 alloy
    (2007) Kumar, G.; Hegde, S.; Prabhu, K.N.
    Al-Si alloys are subjected to melt treatment like modification to improve their mechanical properties. Non-destructive technique like thermal analysis is generally used to assess the effectiveness of melt treatment. In the present study, the behaviour of the melt treated Al-7Si-Mg alloy (A357) during solidification with or without chilling was investigated using thermal analysis. Thermal analysis and heat transfer parameters were determined. Thermal analysis parameters were affected significantly by modification and chilling. Modification treatment resulted in the increase of cooling rate, heat evolved, casting/mould interfacial heat flux and eutectic growth velocity. A theoretical model based on undercooling from the equilibrium temperature during eutectic solidification was used to predict growth velocities and eutectic grain size. The eutectic grain sizes estimated using the model and those measured from casting microstructures were found to be in good agreement. © 2006 Elsevier B.V. All rights reserved.
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    Thermal contact at solder/substrate interfaces during solidification
    (2009) Nyamannavar, S.; Prabhu, K.N.
    Heat flux transients at the solder/substrate interface during the solidification of Sn-37Pb and Sn-3.5Ag solder alloys against metallic substrates were estimated by the lumped heat capacitance model and the contact condition was assessed by scanning electronic microscopy (SEM). Copper substrates yielded maximum contact heat flux followed by brass and aluminium substrates. The SEM study in the solder/substrate interfacial region revealed the existence of a clear gap with the aluminium substrate. A conforming contact was obtained with copper and brass substrates. © 2009 Institute of Materials, Minerals and Mining.
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    Heat flux transients and casting surface macro-profile during downward solidification of Al-12% Si alloy against chills
    (American Foundry Society, 2011) Prabhu, K.N.; Sharath, K.; Ramesh, G.
    Heat flux transients were estimated during downward solidificationofAl- 12%Sialloy(A413)againstaluminumand graphite chills. The thermal plot of graphite chill indicated one-dimensional heat flow in the initial stages which then changes to two-dimensional heat transfer. The heat transfer becomes one-dimensional again during the final stages of solidification. In aluminum chill, heat flow was nearly one- dimensional. Experiments were designed to verify whether the peak heat flux is an artifact of the experiment. The results clearly showed that the occurrence of the peak in the heat flux transients is not an artifact of the inverse model or the experimental technique. The macro-profile of the casting surface in contact with the chill revealed the occurrence of crests and troughs. A mechanism based on the convection within the liquid metal below the solid shell was proposed to account for the formation of wavy casting surface. Copyright © 2011 American Foundry Society.
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    Effect of modification melt treatment and chilling on eutectic arrest temperature and time during solidification of A357 alloy
    (2011) Prabhu, K.N.; Hegde, S.
    Thermal analysis technique has been recognised as an efficient non-destructive tool to assess the degree of modification in Al-Si alloys. Apart from chemical modification, chilling refines the microstructure. This is particularly significant as majority of Al-Si alloys are cast in metallic moulds. In the present study, the interaction between chilling and modification melt treatment is investigated to assess their effect on thermal analysis parameters using computer aided cooling curve analysis. For modified alloys, the depression of the eutectic arrest temperature was significant at higher cooling rates. The eutectic arrest temperature and time were correlated with the cooling rate using a power law. High cooling regime in thermal analysis plots was attributed to the combined effect of chilling and modification melt treatment on heat transfer. © 2011 Institute of Materials, Minerals and Mining.
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    Heat transfer during solidification of chemically modified Al-Si alloys around a copper chill
    (2011) Prabhu, K.N.; Hegde, S.
    The solidifying metal/chill contour will significantly affect the boundary heat transfer coefficients, and solidification modellers should be aware of the casting conditions for which the heat transfer coefficients are determined. The previous work carried out on solidification of Al-Si alloys in a metallic mould and solidification against bottom/top chills has shown that modification and chilling have synergetic effect resulting in a significant increase in the heat flux transients at the casting/chill interface. In the present work, the heat transfer during solidification of unmodified and chemically modified Al-Si alloys around a cylindrical copper chill was investigated. Heat flux transients were estimated using lumped heat capacitance method. Lower peak heat flux was obtained with chemically modified alloy. This is in contrast to the results reported for alloys solidifying against chills and in metallic moulds. The chill thermal behaviour and heat transfer to the chill material when surrounded by modified and unmodified alloys were explained on the basis of the decrease in the degree of undercooling in the case of modified alloy as compared to unmodified alloy and the change in contact condition and shrinkage characteristics of the alloy due to the addition of chemical modifiers. © 2011 Institute of Materials, Minerals and Mining.
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    Effect of cooling rate during solidification of Sn-9Zn lead-free solder alloy on its microstructure, tensile strength and ductile-brittle transition temperature
    (Elsevier Ltd, 2012) Prabhu, K.N.; Deshapande, P.; Satyanarayan, S.
    Solidification rate is an important variable during processing of materials, including soldering, involving solidification. The rate of solidification controls the metallurgical microstructure at the solder joint and hence the mechanical properties. A high tensile strength and a lower ductile-brittle transition temperature are necessary for reliability of solder joints in electronic circuits. Hence in the present work, the effect of cooling rate during solidification on microstructure, impact and tensile properties of Sn-9Zn lead-free solder alloy was investigated. Four different cooling media (copper and stainless steel moulds, air and furnace cooling) were used for solidification to achieve different cooling rates. Solder alloy solidified in copper mould exhibited higher cooling rate as compared to other cooling media. The microstructure is refined as the cooling rate was increased from 0.03 to 25 °C/s. With increase in cooling rate it was observed that the size of Zn flakes became finer and distributed uniformly throughout the matrix. Ductile-to-brittle transition temperature (DBTT) of the solder alloy increased with increase in cooling rate. Fractured surfaces of impact test specimens showed cleavage like appearance and river like pattern at very low temperatures and dimple like appearance at higher temperatures. The tensile strength of the solder alloy solidified in Cu and stainless moulds were higher as compared to air and furnace cooled samples. It is therefore suggested that the cooling rate during solidification of the solder alloy should be optimum to maximize the strength and minimize the DBTT. © 2011 Elsevier B.V.