Faculty Publications
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Item Estimation of Heat Flux Transient During Quench Hardening of Varying Diameter Steel Probes Using IHCP-Phase Transformation Coupled Model(ASM International, 2023) Samuel, A.; Nayak, U.V.; Pranesh Rao, K.M.P.; Prabhu, K.N.The phase transformation model is coupled with the inverse heat conduction problem (IHCP) to estimate the steel/quenchant interfacial heat flux. Cylindrical steel probes having section thicknesses 25 and 50mm, respectively, and lengths 30mm were made from medium and high carbon steels (AISI 1045 and 52100). The probes were quenched in mineral, neem, and sunflower oils. The cooling curves at the centre and near the surface of steel probes were recorded. The near-surface cooling curve was used as a reference temperature data in the IHCP algorithm for the estimation of surface heat flux, whereas the cooling curve at the centre was used as the boundary condition of the axisymmetric model of the probe. The effect of phase transformation on the metal/quenchant interfacial heat flux was indicated by a kink and rise of heat flux. The increase in the section thickness of the probe from 25 to 50mm decreased the magnitude of the heat flux. Increasing section thickness increases the phase transformation, increasing the resistance to heat flow at the metal/quenchant interface. © © 2023 ASM International®Item Effect of surface roughness on metal/quenchant interfacial heat transfer and evolution of microstructure(Elsevier Ltd, 2007) Prabhu, K.N.; Fernandes, P.In the present work, the effect of surface roughness on heat transfer rates in various quenchants was determined. The heat flux transients at the probe/quenchant interface were estimated by inverse modeling of heat conduction during end quenching of stainless steel probes with three different surface roughness (grooved, Ra = 3.0 and 1 ?m). Heat transfer during quenching was correlated with the hardness obtained for medium carbon AISI 1060 steel specimens. The effect of surface roughness on heat transfer rate during quenching in water and brine was significant for rough surface whereas its effect on heat transfer rate is only marginal in high viscosity oil quenchants. A fully martensitic structure was observed with grooved surface subjected to water quenching. With a smooth surface a mixed microstructure was obtained. The oil quenched specimens were found to be less sensitive to surface roughness. © 2005 Elsevier Ltd. All rights reserved.Item Effect of thermal contact heat transfer on solidification of Pb-Sn and Pb-free solders(Elsevier Ltd, 2007) Chellaih, T.; Kumar, G.; Prabhu, K.N.The effect of thermal contact heat transfer on the solidification of spherical droplets of four solder alloys, namely, Sn-37Pb, Sn-9Zn, Sn-0.7Cu and Sn-3.5Ag, was studied using SOLIDCAST simulation package. A significant drop in the arrest time was observed for increase in heat transfer coefficient from 1000 to 2000 W/m2 K. Effect of contact conductance and thermal diffusivity of solder alloys on arrest time is quantified by the power relation, ? = m(?{symbol})n where ? and ?{symbol} are defined as arrest time and heat transfer parameters, respectively. Experiments were also carried out to investigate the effect of cooling rate on solidification behaviour of the solder alloys used in simulation. The results indicated the significant effect of mould material on interfacial heat flux and metallurgical microstructure. © 2005 Elsevier Ltd. All rights reserved.Item Heat transfer and solidification behaviour of modified A357 alloy(2007) Kumar, G.; Hegde, S.; Prabhu, K.N.Al-Si alloys are subjected to melt treatment like modification to improve their mechanical properties. Non-destructive technique like thermal analysis is generally used to assess the effectiveness of melt treatment. In the present study, the behaviour of the melt treated Al-7Si-Mg alloy (A357) during solidification with or without chilling was investigated using thermal analysis. Thermal analysis and heat transfer parameters were determined. Thermal analysis parameters were affected significantly by modification and chilling. Modification treatment resulted in the increase of cooling rate, heat evolved, casting/mould interfacial heat flux and eutectic growth velocity. A theoretical model based on undercooling from the equilibrium temperature during eutectic solidification was used to predict growth velocities and eutectic grain size. The eutectic grain sizes estimated using the model and those measured from casting microstructures were found to be in good agreement. © 2006 Elsevier B.V. All rights reserved.Item Effect of section size and agitation on heat transfer during quenching of AISI 1040 steel(2007) Fernandes, P.; Prabhu, K.N.In the present work an attempt has been made to determine the heat flux transients during quenching of Ø28 mm × 56 mm height and Ø44 mm × 88 mm height AISI 1040 steel specimens during lateral quenching in brine, water, palm oil and mineral oil. The heat flux transients were estimated by inverse modeling of heat conduction. The variation of heat flux transients with surface temperature for different quenching media is investigated. Higher peak heat flux transients are obtained for 28 mm diameter specimen than 44 mm diameter specimen during quenching in aqueous media. However quenching with oil media shows opposite results. Agitation of quenching medium increases the peak heat flux during the quenching of steel specimen in all the quenching media. Peak hardness is obtained at the surface and with smaller diameter specimens during agitation. © 2006 Elsevier B.V. All rights reserved.Item Thermal contact at solder/substrate interfaces during solidification(2009) Nyamannavar, S.; Prabhu, K.N.Heat flux transients at the solder/substrate interface during the solidification of Sn-37Pb and Sn-3.5Ag solder alloys against metallic substrates were estimated by the lumped heat capacitance model and the contact condition was assessed by scanning electronic microscopy (SEM). Copper substrates yielded maximum contact heat flux followed by brass and aluminium substrates. The SEM study in the solder/substrate interfacial region revealed the existence of a clear gap with the aluminium substrate. A conforming contact was obtained with copper and brass substrates. © 2009 Institute of Materials, Minerals and Mining.Item Heat flux transients and casting surface macro-profile during downward solidification of Al-12% Si alloy against chills(American Foundry Society, 2011) Prabhu, K.N.; Sharath, K.; Ramesh, G.Heat flux transients were estimated during downward solidificationofAl- 12%Sialloy(A413)againstaluminumand graphite chills. The thermal plot of graphite chill indicated one-dimensional heat flow in the initial stages which then changes to two-dimensional heat transfer. The heat transfer becomes one-dimensional again during the final stages of solidification. In aluminum chill, heat flow was nearly one- dimensional. Experiments were designed to verify whether the peak heat flux is an artifact of the experiment. The results clearly showed that the occurrence of the peak in the heat flux transients is not an artifact of the inverse model or the experimental technique. The macro-profile of the casting surface in contact with the chill revealed the occurrence of crests and troughs. A mechanism based on the convection within the liquid metal below the solid shell was proposed to account for the formation of wavy casting surface. Copyright © 2011 American Foundry Society.Item Heat transfer during solidification of chemically modified Al-Si alloys around a copper chill(2011) Prabhu, K.N.; Hegde, S.The solidifying metal/chill contour will significantly affect the boundary heat transfer coefficients, and solidification modellers should be aware of the casting conditions for which the heat transfer coefficients are determined. The previous work carried out on solidification of Al-Si alloys in a metallic mould and solidification against bottom/top chills has shown that modification and chilling have synergetic effect resulting in a significant increase in the heat flux transients at the casting/chill interface. In the present work, the heat transfer during solidification of unmodified and chemically modified Al-Si alloys around a cylindrical copper chill was investigated. Heat flux transients were estimated using lumped heat capacitance method. Lower peak heat flux was obtained with chemically modified alloy. This is in contrast to the results reported for alloys solidifying against chills and in metallic moulds. The chill thermal behaviour and heat transfer to the chill material when surrounded by modified and unmodified alloys were explained on the basis of the decrease in the degree of undercooling in the case of modified alloy as compared to unmodified alloy and the change in contact condition and shrinkage characteristics of the alloy due to the addition of chemical modifiers. © 2011 Institute of Materials, Minerals and Mining.Item Characterisation of water base copper nanoquenchants by standard cooling curve analysis(2011) Ramesh, G.; Prabhu, K.N.Water base copper nanofluids having concentrations varying from 0?001 to 0?1 vol.-% were prepared and used as quench media for immersion quenching. Cooling curve analyses were carried out by using a standard ISO/DIS 9950 quench probe. An inverse heat conduction model is employed to estimate the metal/nanoquenchant interfacial heat flux transients from the measured temperature field and thermophysical properties of the quench probe material. The addition of copper nanoparticles had a significant effect on the occurrence of the vapour blanket stage and nucleate boiling stage. Furthermore, all six cooling curve parameters were found to be altered by adding nanoparticles to water. The contact angle of water decreased from 67 to 39° by adding 0?1 vol.-% of copper nanoparticles indicating the improved wettability of nanofluids. The heat flux curve shows a maximum initially then drops rapidly during quenching. The peak cooling rate and heat flux of water increased by adding copper nanoparticles up to 0?01 vol.-%. Both parameters decreased with further increase in concentration of nanoparticles. The results suggest that the quench severity of water could be altered by adding copper nanoparticles. © 2011 IHTSE Partnership.Item Effect of chemical modification of Al-Si alloys on thermal diffusivity and contact heat transfer at the casting-chill interface(2012) Prabhu, K.N.; Jayananda; Hegde, S.The heat flow during the unidirectional downward solidification of Al-7Si and Al-12Si alloys was analyzed using thermal analysis technique and inverse modeling. Chills instrumented with thermocouples were brought into contact with a small pool of liquid metal so as to minimize the effect of convection caused by pouring and temperature gradients. Modification melt treatment resulted in an increase in the cooling rate of the solidifying casting near the casting-chill interfacial region. The corresponding interfacial heat flux transients were also found to be higher. The thermal diffusivities of alloys were measured using a laser pulse technique and were found to be higher for modified alloys. However, the increase in the heat flux transients was attributed mainly to the improvement in the casting-chill interfacial thermal contact condition brought about by the decrease in the surface tension of the liquid metal upon the addition of sodium. Copyright © 2012 by ASTM International.