Faculty Publications
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Item The microstructure of a solidifying lead free Sn-3.5Ag solder alloy is found to be highly sensitive to the surface condition of the copper substrate. A transition from lamellar to fine fibrous eutectic structure is observed as the surface condition of the substrate is altered by increasing the surface roughness and application of flux. This is attributed to lowering of interfacial tension and improved wetting of the solidifying solder on the substrate material leading to a better contact at the metal/substrate interface. The results also indicated the importance of surface texture of the substrate and the application of the flux to the quality of the solder/substrate joint. © 2003 Elsevier Ltd. All rights reserved.(Elsevier Ltd, Effect of substrate surface texture and flux coating on the evolution of microstructure during solidification of lead free Sn-3.5Ag solder alloy) Prabhu, K.; Bali, R.; Ranjan, R.2004Item The effect of the addition of strontium and cerium modifiers on microstructure and mechanical properties of hypereutectic Al-Si (LM30) alloy(ASTM International, 2013) Vijayan, V.; Ravi, M.; Prabhu, K.The present work deals with the melt treatment of LM30 hypereutectic Al-Si alloy using cerium and strontium and the assessment of its effect on microstructure and properties of the alloy. The addition of cerium simultaneously modified both primary and eutectic silicon, leading to an increase in ultimate tensile strength, as well as the wear resistance of the alloy. It was found that the coefficient of thermal expansion of the alloy decreased on modification of the microstructure. © 2013 by ASTM International.Item Effect of chilling and cerium addition on microstructure and cooling curve parameters of Al-14%Si alloy(Maney Publishing maney@maney.co.uk, 2015) Vijayan, V.; Prabhu, K.Al-14%Si alloys, with and without cerium, were cast at varying cooling rates by solidifying them in a crucible and against chills. The effect of melt treatment and chilling on microstructure and cooling curve parameters of the alloy was assessed. Ce treated alloys solidified in clay graphite crucible at a slow cooling rate showed refinement of primary silicon and the formation of Al-Si-Ce ternary intermetallic compound. The addition of Ce to the alloy solidified against chills resulted in simultaneous refinement and modification of primary and eutectic silicon. Nucleation temperatures of both primary and eutectic silicon decreased on addition of cerium. The formation of the intermetallic compound decreased with increase in cooling rate, leading to the modification of the eutectic silicon. The increase in the degree of modification of the eutectic Si was associated with the decrease in the volume fraction of the intermetallic compound formed. © 2015 Canadian Institute of Mining, Metallurgy and Petroleum Published by Maney on behalf of the Institute.Item The Effect of Chilling and Ce Addition on the Microstructure and Mechanical Properties of Al-23Si Alloy(Springer New York LLC barbara.b.bertram@gsk.com, 2017) Vijayan, V.; Prabhu, K.The present work involves the study of the effect of varying concentration of Ce addition on microstructure and mechanical properties of Al-23%Si alloys. Melt-treated alloys were solidified in copper, brass, stainless steel molds to assess the effect of cooling rate. The effect on microstructure was assessed by measuring the fineness of primary silicon and eutectic silicon particle characteristics. The Ce melt treatment transformed the coarse and irregular primary silicon into refined polyhedral silicon crystals, and the effect was more significant at higher cooling rates. Although the melt treatment had refined the eutectic silicon at lower cooling rates, it did not show any considerable effect on the eutectic silicon at higher cooling rates. The mechanical properties of the alloy increased significantly with increase in cooling rates and cerium concentration. Analysis of the results and literature reveals that the refined primary silicon was formed as a result of an invariant reaction between Ce compounds and primary silicon at higher temperatures. © 2016, ASM International.