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Thermodynamic irreversibility and conjugate effects of integrated microchannel cooling device using TiO2 nanofluid
(Springer, 2020) Narendran, G.; Gnanasekaran, N.; Arumuga Perumal, A.P.
Thermal management is highly essential for the latest electronic devices to effectively dissipate heat in a densely packed environment. Usually, these high power devices are cooled by integrating micro scale cooling systems. Most of the works reported in the literature majorly concentrate on microchannel heat sink in which the characteristics of friction factor and enhancement of heat transfer are analyzed in detail. However, due to the advent of compact electronic devices a crucial investigation is required to facilitate an amicable environment for the neighboring components so as to improve the reliability of the electronic devices. Henceforth, in the present study a combined experimental and numerical analysis is performed to provide an insight to determine the performance of a copper microchannel integrated with aluminium block using TiO2 nanofluid for different particle configurations. Needless to say, the present study, which also focuses on entropy generation usually attributed to the thermodynamic irreversibility, is very much significant to design an optimum operating condition for better reliability and performance of the cooling devices. © 2019, Springer-Verlag GmbH Germany, part of Springer Nature.
Experimental Investigation on Heat Spreader Integrated Microchannel Using Graphene Oxide Nanofluid
(Taylor and Francis Ltd. michael.wagreich@univie.ac.at, 2020) Narendran, G.; Gnanasekaran, N.; Arumuga Perumal, D.A.
Thermal design consideration is highly essential for efficient heat dissipation in advanced microprocessors which are subjected to conjugate heat transfer under high heat flux with a minimal area for cooling. Generally, these multicore processors develop a localized high density heat flux referred to as hotspot. The effective use of microchannel in order to mitigate the hotspot is found in literature; however, the flow induced hotspot still exist due to maldistribution of flow inside the microchannel. Henceforth, the present study provides an experimental insight on laminar forced convection in a parallel microchannel heat sink accompanied with 1.2 mm thin copper heat spreader with a surface area of 30 mm2 to effectively migrate the maldistribution flow induced hot spot. The present experimental study provides a profound insight about the hotspot and migration of hotspot to safe zones; as a result, not only the performance of the multi core microprocessor is highly improved but also the reliability of neighboring components is well secured. © 2019, © 2019 Taylor & Francis Group, LLC.
Integrated microchannel cooling for densely packed electronic components using vanadium pentaoxide (V2O5)-xerogel nanoplatelets-based nanofluids
(Springer Science and Business Media B.V., 2023) Narendran, G.; Gnanasekaran, N.; Arumuga Perumal, D.A.; Moolayadukkam, M.; Nagaraja, H.S.
The present study reports the implementation of novel nanoplatelets-based vanadium pent oxide (V2O5)-xerogel for the application of conjugate cooling in densely packed electronic devices. An integrated heat sink is made up of copper with a channel width of 490 µm and is shrink-fitted into aluminium block that acts as a heat spreader. V2O5-xerogel is synthesized by melt quenching process and characterized based on field emission scanning electron microscope, transmission electron microscope, and X-ray diffraction to analyse the surface morphology of the particles. Studies related to the stability of the nanofluids for different concentrations are discussed in this paper. Furthermore, a study on the effect of pulsating flow in microchannel is performed for different flow rates. As a result, a maximum enhancement of 17% in heat transfer coefficient was observed for the concentration of 0.4 mass% with a flow rate of 200 mL min-1 compared to a pure fluid. Finally, the results reveal that the xerogel is a potential working fluid for heat transfer applications involving microscale devices. © 2023, Akadémiai Kiadó, Budapest, Hungary.
Experimental investigation on additive manufactured single and curved double layered microchannel heat sink with nanofluids
(Springer Science and Business Media Deutschland GmbH, 2023) Narendran, G.; Mallikarjuna, B.; Nagesha, B.K.; Gnanasekaran, N.
For the latest high density compact devices, thermal management is crucial for their effective heat dissipation and system reliability. In literature, microchannel heat sink has been established as one of the advanced heat transfer techniques to fulfill the cooling demands of high power electronic applications. However, maldistribution in microchannels causes flow induced high temperature zones (FITZ) which reduces the electrical performance owing to electrical-thermal instability of the integrated chips. One way to mitigate the FITZ is by allowing more coolant inlets in these zones. In the current study, this is achieved by redesigning double layer microchannel heat sink (DMCHS) specific to the FITZ of I-type microchannel configuration using additive manufacturing (AM). Two AM microchannels were tested, one is a single layer microchannel heat sink (MCHS) and another one is a curved double layer microchannel (C-DMCHS). The curved channels were introduced in the bottom channels of C-DMCHS to mitigate FITZ compared to conventional DMCHS. AM microchannels are compared for Nusselt number and friction factor characteristics with the conventional straight channels, and heat treated AM microchannels. From experimental observation, Ti64 3D printed microchannel with Graphene oxide (GO-0.12%) nanofluid developed 75.4% more pressure drop than the Ti64 heat treated microchannel. The results additionally show that the C-DMCHS delivered 26.5% lower FITZ temperature than MCHS. © 2023, The Author(s), under exclusive licence to Springer-Verlag GmbH Germany, part of Springer Nature.

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