Faculty Publications

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Author: search.filters.author.Narendran, G.Subject: search.filters.subject.Electronic cooling

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    Integrated microchannel cooling for densely packed electronic components using vanadium pentaoxide (V2O5)-xerogel nanoplatelets-based nanofluids
    (Springer Science and Business Media B.V., 2023) Narendran, G.; Gnanasekaran, N.; Arumuga Perumal, D.A.; Moolayadukkam, M.; Nagaraja, H.S.
    The present study reports the implementation of novel nanoplatelets-based vanadium pent oxide (V2O5)-xerogel for the application of conjugate cooling in densely packed electronic devices. An integrated heat sink is made up of copper with a channel width of 490 µm and is shrink-fitted into aluminium block that acts as a heat spreader. V2O5-xerogel is synthesized by melt quenching process and characterized based on field emission scanning electron microscope, transmission electron microscope, and X-ray diffraction to analyse the surface morphology of the particles. Studies related to the stability of the nanofluids for different concentrations are discussed in this paper. Furthermore, a study on the effect of pulsating flow in microchannel is performed for different flow rates. As a result, a maximum enhancement of 17% in heat transfer coefficient was observed for the concentration of 0.4 mass% with a flow rate of 200 mL min-1 compared to a pure fluid. Finally, the results reveal that the xerogel is a potential working fluid for heat transfer applications involving microscale devices. © 2023, Akadémiai Kiadó, Budapest, Hungary.
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    Experimental investigation on additive manufactured single and curved double layered microchannel heat sink with nanofluids
    (Springer Science and Business Media Deutschland GmbH, 2023) Narendran, G.; Mallikarjuna, B.; Nagesha, B.K.; Gnanasekaran, N.
    For the latest high density compact devices, thermal management is crucial for their effective heat dissipation and system reliability. In literature, microchannel heat sink has been established as one of the advanced heat transfer techniques to fulfill the cooling demands of high power electronic applications. However, maldistribution in microchannels causes flow induced high temperature zones (FITZ) which reduces the electrical performance owing to electrical-thermal instability of the integrated chips. One way to mitigate the FITZ is by allowing more coolant inlets in these zones. In the current study, this is achieved by redesigning double layer microchannel heat sink (DMCHS) specific to the FITZ of I-type microchannel configuration using additive manufacturing (AM). Two AM microchannels were tested, one is a single layer microchannel heat sink (MCHS) and another one is a curved double layer microchannel (C-DMCHS). The curved channels were introduced in the bottom channels of C-DMCHS to mitigate FITZ compared to conventional DMCHS. AM microchannels are compared for Nusselt number and friction factor characteristics with the conventional straight channels, and heat treated AM microchannels. From experimental observation, Ti64 3D printed microchannel with Graphene oxide (GO-0.12%) nanofluid developed 75.4% more pressure drop than the Ti64 heat treated microchannel. The results additionally show that the C-DMCHS delivered 26.5% lower FITZ temperature than MCHS. © 2023, The Author(s), under exclusive licence to Springer-Verlag GmbH Germany, part of Springer Nature.