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Author: search.filters.author.Bharadishettar, N.Subject: search.filters.subject.Acid pickling

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    Effect of acid pickling treatment of stainless steel substrate on adhesion strength of electrodeposited copper coatings using non-cyanide electrolyte
    (Elsevier Ltd, 2023) Bharadishettar, N.; Udaya Bhat, K.
    In recent years, copper-based antimicrobial coatings have gained popularity in healthcare and public recreation facilities. The morphology, topography, and adhesion strength are decisive properties for copper coatings to have long-term antimicrobial effectiveness in hospital environments. This work explores the effect of multistage acid pickling treatment of AISI 304 stainless steel substrate on the adhesion strength of the copper coating. The copper coating was obtained by electrodeposition using an alkaline non-cyanide electrolyte. After the fourth stage of acid pickling, the copper coating had an excellent adhesion strength, up to 9 MPa. Glow discharge optical emission spectroscopy (GDOES) examination revealed no oxide scales or other contaminants on the SS surface after the fourth (final) stage of acid pickling. Using a non-contact optical profilometer, it was observed that the roughness of the substrate increased with each stage of the pickling treatment. The surface topography analysis confirms the increased density of the interlocking sites, which favors the adhesion of the coating. On the other hand, the microstructure of the copper coating showed a cauliflower-like morphology with an average nodule size of 28 nm. Transmission electron microscopy confirmed that the coatings have nano-scaled crystallites with internal twins inside the grains of copper coatings. © 2023 Elsevier Ltd
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    Development of adherent antimicrobial copper coatings on stainless steel for healthcare applications
    (Springer, 2023) Bharadishettar, N.; Bhat, K.U.; Bhat, K.S.
    Copper coatings were fabricated using an environmentally sustainable non-cyanide electrodeposition technique. By following four-stage acid pickling treatment of the substrate and optimum parameters during electrodeposition, adhesion strength up to 9 MPa was obtained. Four different copper coatings were fabricated by varying CuSO4. 5H2O concentration in an electrolyte (10, 15, 30, and 45 g/L) to understand nucleation and growth mechanism and surface texture evolution. Nano-nodular morphology of the deposited copper marks a significant feature. It increases the fraction of grain boundaries in it. The grazing incidence X-ray diffraction analysis revealed the preferred orientation along the (111) plane with the presence of residual compressive stresses (in the range of 24.90–273.92 MPa). Surface texture studies indicated that the coating had an abundance of nano-scaled protruding structures with surface roughness’s Sa in the range of 2.507–1.674 µm (Ra in a range of 1.714–1.235 µm). It offers 3D contact with microbes. The developed coating had increased hardness (41.93%), scratch resistance (58.77%), and 9 MPa adhesion strength with the substrate. Initially, copper coatings had hydrophobicity against water (initial contact angle in the range of 134–139°). The extent of hydrophobicity decreased with exposure time. The developed coatings exhibited significant antimicrobial activity. Antimicrobial studies using the cell viability technique indicated that the coating exhibits toxicity against Escherichia coli (ATCC25922) and Staphylococcus aureus (MCC2408) microbes. 100% reduction of the survival of microbes is observed after 4 h of exposure. Graphical Abstract: [Figure not available: see fulltext.]. © 2023, The Author(s), under exclusive licence to Springer Science+Business Media, LLC, part of Springer Nature.