Faculty Publications
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Item Physical, mechanical and sliding wear behavior of solid glass microsphere filled epoxy composites(Elsevier Ltd, 2018) Agrawal, A.; Chandraker, S.; Sharma, A.Performance of epoxy based composites filled with micro-size solid glass microsphere (SGM) is reported in this work. The main emphasis of the present work is on the common trends detected in properties of epoxy/SGM composites. For physical property, densities of all the fabricated samples were presented.Glass micro-sphere filled epoxy composites haveless porosity. They also exhibit improvedmicro-hardness, flexural and impact strength, though tensile strength is compromised marginally. Further, sliding wear performance of the fabricated composites with respect to filler content, sliding velocity and applied force were studied.With improved physical, mechanical and sliding wear, the presently fabricated composites found its potential application where wear predominated. © 2018 Elsevier Ltd. All rights reserved.Item An experimental investigation of epoxy-based hybrid composites with hexagonal boron nitride and short sisal fiber as reinforcement for high performance microelectronic applications(John Wiley and Sons Inc, 2022) Agrawal, A.; Chandraker, S.In the present article, an investigation is presented on epoxy-based composites where the discontinuous phases are microsized boron nitride and sisal fiber (SF). Both the reinforcing materials are surface modified before incorporating them into the epoxy matrix. Hexagonal boron nitride (hBN) surface is treated by silane-coupling agent, whereas the aqueous NaOH solution is used to modify the surface of SF. The effect of fillers on the physical, mechanical, thermal, and dielectric properties of hybrid composites is studied through experimentation. The result shows that the inclusion of hBN increases the thermal conductivity of epoxy appreciably and dielectric constant marginally, while the inclusion of SF reduces the thermal conductivity marginally and dielectric constant appreciably. The maximum thermal conductivity of 1.88 W/m-K is obtained for the combination of 30 wt% hBN and 3 wt% SF. For the same combination, the dielectric constant is 4.57 at 1 GHz, which is almost similar to neat epoxy. Also, other properties like compressive strength, hardness, glass-transition temperature, and coefficient of thermal expansion improve when combinations of ceramic filler and natural fiber were incorporated in the epoxy matrix. Due to outstanding comprehensive properties, epoxy/hBN/SF composites found potential application in wide microelectronic applications. © 2021 Society of Plastics Engineers.Item Development and Characterization of Epoxy-Based Polymeric Composite with Bio-particulates as Filler Material(Springer Science and Business Media Deutschland GmbH, 2022) Chandraker, S.; Dutt, J.K.; Agrawal, A.; Roy, H.; Rajkumar; Chandrakar, K.; Mishra, V.The focus of this paper is to develop cheap and unconventional materials for both structural and non-structural applications using eco-friendly bio-wastes. The study used pistachio nutshells (normally disposed of as waste) for fabricating bio-particulate-based polymeric composites. In this investigation, epoxy is taken as matrix material and pistachio nutshells in the form of microparticles are used as filler material. Six different sets of composites with varying filler content up to a maximum of 30 wt% are fabricated by a hand lay-up method. The excellent compatibility and bonding between the matrix and filler material under investigation are confirmed by micrograph obtained from scanning electron microscopy and by Fourier-transform infrared spectroscopy analysis. Physical and mechanical properties are evaluated experimentally as per ASTM. Apart from that, a linear viscoelastic semi-solid model is reported here to understand the mechanical dynamic behaviour of the developed material. On the basis of several test result, the developed composite may find its potential application in light-duty structures efficiently. © 2021, King Fahd University of Petroleum & Minerals.