Journal Articles
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Item Effect of thermal contact heat transfer on solidification of Pb-Sn and Pb-free solders(Elsevier Ltd, 2007) Chellaih, T.; Kumar, G.; Prabhu, K.N.The effect of thermal contact heat transfer on the solidification of spherical droplets of four solder alloys, namely, Sn-37Pb, Sn-9Zn, Sn-0.7Cu and Sn-3.5Ag, was studied using SOLIDCAST simulation package. A significant drop in the arrest time was observed for increase in heat transfer coefficient from 1000 to 2000 W/m2 K. Effect of contact conductance and thermal diffusivity of solder alloys on arrest time is quantified by the power relation, ? = m(?{symbol})n where ? and ?{symbol} are defined as arrest time and heat transfer parameters, respectively. Experiments were also carried out to investigate the effect of cooling rate on solidification behaviour of the solder alloys used in simulation. The results indicated the significant effect of mould material on interfacial heat flux and metallurgical microstructure. © 2005 Elsevier Ltd. All rights reserved.Item Heat transfer and solidification behaviour of modified A357 alloy(2007) Kumar, G.; Hegde, S.; Prabhu, K.N.Al-Si alloys are subjected to melt treatment like modification to improve their mechanical properties. Non-destructive technique like thermal analysis is generally used to assess the effectiveness of melt treatment. In the present study, the behaviour of the melt treated Al-7Si-Mg alloy (A357) during solidification with or without chilling was investigated using thermal analysis. Thermal analysis and heat transfer parameters were determined. Thermal analysis parameters were affected significantly by modification and chilling. Modification treatment resulted in the increase of cooling rate, heat evolved, casting/mould interfacial heat flux and eutectic growth velocity. A theoretical model based on undercooling from the equilibrium temperature during eutectic solidification was used to predict growth velocities and eutectic grain size. The eutectic grain sizes estimated using the model and those measured from casting microstructures were found to be in good agreement. © 2006 Elsevier B.V. All rights reserved.Item Thermal contact at solder/substrate interfaces during solidification(2009) Nyamannavar, S.; Prabhu, K.N.Heat flux transients at the solder/substrate interface during the solidification of Sn-37Pb and Sn-3.5Ag solder alloys against metallic substrates were estimated by the lumped heat capacitance model and the contact condition was assessed by scanning electronic microscopy (SEM). Copper substrates yielded maximum contact heat flux followed by brass and aluminium substrates. The SEM study in the solder/substrate interfacial region revealed the existence of a clear gap with the aluminium substrate. A conforming contact was obtained with copper and brass substrates. © 2009 Institute of Materials, Minerals and Mining.Item Heat flux transients and casting surface macro-profile during downward solidification of Al-12% Si alloy against chills(American Foundry Society, 2011) Prabhu, K.N.; Sharath, K.; Ramesh, G.Heat flux transients were estimated during downward solidificationofAl- 12%Sialloy(A413)againstaluminumand graphite chills. The thermal plot of graphite chill indicated one-dimensional heat flow in the initial stages which then changes to two-dimensional heat transfer. The heat transfer becomes one-dimensional again during the final stages of solidification. In aluminum chill, heat flow was nearly one- dimensional. Experiments were designed to verify whether the peak heat flux is an artifact of the experiment. The results clearly showed that the occurrence of the peak in the heat flux transients is not an artifact of the inverse model or the experimental technique. The macro-profile of the casting surface in contact with the chill revealed the occurrence of crests and troughs. A mechanism based on the convection within the liquid metal below the solid shell was proposed to account for the formation of wavy casting surface. Copyright © 2011 American Foundry Society.Item Effect of modification melt treatment and chilling on eutectic arrest temperature and time during solidification of A357 alloy(2011) Prabhu, K.N.; Hegde, S.Thermal analysis technique has been recognised as an efficient non-destructive tool to assess the degree of modification in Al-Si alloys. Apart from chemical modification, chilling refines the microstructure. This is particularly significant as majority of Al-Si alloys are cast in metallic moulds. In the present study, the interaction between chilling and modification melt treatment is investigated to assess their effect on thermal analysis parameters using computer aided cooling curve analysis. For modified alloys, the depression of the eutectic arrest temperature was significant at higher cooling rates. The eutectic arrest temperature and time were correlated with the cooling rate using a power law. High cooling regime in thermal analysis plots was attributed to the combined effect of chilling and modification melt treatment on heat transfer. © 2011 Institute of Materials, Minerals and Mining.Item Heat transfer during solidification of chemically modified Al-Si alloys around a copper chill(2011) Prabhu, K.N.; Hegde, S.The solidifying metal/chill contour will significantly affect the boundary heat transfer coefficients, and solidification modellers should be aware of the casting conditions for which the heat transfer coefficients are determined. The previous work carried out on solidification of Al-Si alloys in a metallic mould and solidification against bottom/top chills has shown that modification and chilling have synergetic effect resulting in a significant increase in the heat flux transients at the casting/chill interface. In the present work, the heat transfer during solidification of unmodified and chemically modified Al-Si alloys around a cylindrical copper chill was investigated. Heat flux transients were estimated using lumped heat capacitance method. Lower peak heat flux was obtained with chemically modified alloy. This is in contrast to the results reported for alloys solidifying against chills and in metallic moulds. The chill thermal behaviour and heat transfer to the chill material when surrounded by modified and unmodified alloys were explained on the basis of the decrease in the degree of undercooling in the case of modified alloy as compared to unmodified alloy and the change in contact condition and shrinkage characteristics of the alloy due to the addition of chemical modifiers. © 2011 Institute of Materials, Minerals and Mining.Item Effect of cooling rate during solidification of Sn-9Zn lead-free solder alloy on its microstructure, tensile strength and ductile-brittle transition temperature(Elsevier Ltd, 2012) Prabhu, K.N.; Deshapande, P.; Satyanarayan, S.Solidification rate is an important variable during processing of materials, including soldering, involving solidification. The rate of solidification controls the metallurgical microstructure at the solder joint and hence the mechanical properties. A high tensile strength and a lower ductile-brittle transition temperature are necessary for reliability of solder joints in electronic circuits. Hence in the present work, the effect of cooling rate during solidification on microstructure, impact and tensile properties of Sn-9Zn lead-free solder alloy was investigated. Four different cooling media (copper and stainless steel moulds, air and furnace cooling) were used for solidification to achieve different cooling rates. Solder alloy solidified in copper mould exhibited higher cooling rate as compared to other cooling media. The microstructure is refined as the cooling rate was increased from 0.03 to 25 °C/s. With increase in cooling rate it was observed that the size of Zn flakes became finer and distributed uniformly throughout the matrix. Ductile-to-brittle transition temperature (DBTT) of the solder alloy increased with increase in cooling rate. Fractured surfaces of impact test specimens showed cleavage like appearance and river like pattern at very low temperatures and dimple like appearance at higher temperatures. The tensile strength of the solder alloy solidified in Cu and stainless moulds were higher as compared to air and furnace cooled samples. It is therefore suggested that the cooling rate during solidification of the solder alloy should be optimum to maximize the strength and minimize the DBTT. © 2011 Elsevier B.V.Item Effect of chemical modification of Al-Si alloys on thermal diffusivity and contact heat transfer at the casting-chill interface(2012) Prabhu, K.N.; Jayananda; Hegde, S.The heat flow during the unidirectional downward solidification of Al-7Si and Al-12Si alloys was analyzed using thermal analysis technique and inverse modeling. Chills instrumented with thermocouples were brought into contact with a small pool of liquid metal so as to minimize the effect of convection caused by pouring and temperature gradients. Modification melt treatment resulted in an increase in the cooling rate of the solidifying casting near the casting-chill interfacial region. The corresponding interfacial heat flux transients were also found to be higher. The thermal diffusivities of alloys were measured using a laser pulse technique and were found to be higher for modified alloys. However, the increase in the heat flux transients was attributed mainly to the improvement in the casting-chill interfacial thermal contact condition brought about by the decrease in the surface tension of the liquid metal upon the addition of sodium. Copyright © 2012 by ASTM International.Item Heat transfer at the casting/chill interface during solidification of commercially pure Zn and Zn base alloy (ZA8)(2012) Ramesh, G.; Prabhu, K.N.Casting/chill interfacial heat transfer during solidification of commercially pure zinc and ZA8 alloy against copper, hot die steel, stainless steel and aluminiuminstrumented chills was investigated. The peak heat flux strongly depends on the thermophysical properties of chill, chill surface condition and superheat of the castingmaterial. Contact angles of alumina coatingmeasured on various substrates suggested that the adhesion of the coating material on copper chill was significantly better as compared to other chill materials. The heat flux curve in the case of coated chills is characterised by a double peak indicating remelting of the solidified casting shell. The second peak in the HTC curve is lower for high conductivity and higher for low conductivity chills as compared to the first peak. It is possible that solid shell formation and remelting occurred in the case of high thermal conductivity chills, whereas shell remelting did not happen in lower thermal conductivity chills. © 2012 W. S. Maney & Son Ltd.Item Effect of Mn on cooling behaviour and microstructure of chill cast Zn-Al (ZA8) alloy(2012) Ramesh, G.; Vishwanatha, H.M.; Prabhu, K.N.In the present work, the effect of manganese addition to ZA8 alloy on thermal analysis parameters, heat transfer and microstructure was investigated. The thermal analysis parameters were found to be significantly affected by chemical modification of ZA8 alloy. Cooling curve and differential scanning calorimetry analyses of modified alloy showed nucleation of new phase other than b dendrites. Chilling of modified alloy resulted in decreased liquidus temperature and enhanced eutectoid transformation. Further, chilling avoids the formation of intermetallic compounds in modified alloy. The heat flux transients were estimated using inverse modelling during solidification of unmodified and modified alloys against different chills. The peak heat flux decreased on addition of Mn to ZA8 alloy. Differential scanning calorimetry analysis indicated that the addition of Mn to ZA8 alloy decreases the heat of solidification. The addition of Mn to ZA8 alloy increased the contact angle, indicating decreased wettability of the modified alloy on the chill surface. The microstructure of ZA8 with Mn showed an increased amount of b phase and a decreased amount of eutectic. X-ray diffraction analysis confirmed the formation of MnAl6 intermetallics in Mn added ZA8 alloy. Chilling with chemical modification resulted in enhanced decomposition of b phase. © 2012 Institute of Materials, Minerals and Mining.