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Item Performance and reliability of Al2O3 nanoparticles doped multicomponent Sn-3.0Ag-0.5Cu-Ni-Ge solder alloy(Elsevier Ltd, 2020) Tikale, S.; Prabhu, K.N.The effect of Al2O3 nanoparticles addition on melting, microhardness, microstructural, and mechanical properties of multicomponent Sn-3Ag-0.5Cu-0.06Ni-0.01Ge (SACNiGe) solder alloy was investigated. The shear strength of the capacitor assemblies under varying high-temperature environments for different nanocomposites was assessed and the reliability of the joint was determined using Weibull analysis. The SACNiGe solder doped with 0.01 and 0.05 wt% Al2O3 nanoparticles to prepare nanocomposites and tested on the solder joints for their performance and reliability under different thermal conditions. Plain copper and Ni[sbnd]P layer coated substrates were used to investigate the effect of different surface finish on the joint reliability. The addition of ceramic nanoparticles in small amounts did not affect the melting parameters of the solder. In comparison with the bare solder alloy, nanocomposites yielded about 20% increase in tin-climb height and 14% higher microhardness. The dispersion of ceramic nanoparticles in the matrix and presence of Ni and Ge elements in the solder resulted in substantial microstructure refinement and about 24% supression in intermetallic compounds (IMCs) growth at the joint interface. In comparison with the bare Cu substrate, the Ni[sbnd]P coating on the substrate provided a strong diffusion barrier, promoted thin and complex (Cu, Ni)6Sn5 IMC layer formation at the interface, and significantly retarded the IMC growth kinetics under elevated temperature conditions. Under varying thermal conditions, nanoparticles doped solder compositions showed about 20% increase in the joint shear strength value. The reliability of joints improved appreciably with the addition of 0.05 wt% Al2O3 nanoparticles in the solder. Samples with SACNiGe+0.05Al2O3 nanocomposite reflowed on Ni[sbnd]P coating showed about 32% higher reliability than that on the uncoated-copper substrate. The SACNiGe solder joint performance and reliability could be significantly improved by minor weight percent addition of Al2O3 nanoparticles in the presence of Ni[sbnd]P coating on the substrate. © 2020 Elsevier LtdItem Bond shear strength of Al2O3 nanoparticles reinforced 2220-capacitor/SAC305 solder interconnects reflowed on bare and Ni-coated copper substrate(Springer, 2021) Tikale, S.; Prabhu, K.N.The influence of Al2O3 nanoparticles addition in trace amounts and electroless Ni–P substrate coating on the microstructure development and bond shear strength of Sn-3.0Ag–0.5Cu (SAC305) solder joint were investigated. The performance and reliability of the 2220-capacitor joints with Al2O3 nanoparticle reinforced nanocomposites reflowed on Cu and Ni–P coated substrate were analyzed under varying high-temperature environments. The addition of nanoparticles enhanced the wettability and microhardness of the solder and considerably refined the joint microstructure. The dispersion and adsorption of Al2O3 nanoparticles resulted in the suppression of intermetallic (IMC) growth at the interface and refinement of the ?-Sn grains as well as IMC precipitates into the matrix. The Ni–P coating on the substrate significantly retarded the IMC growth kinetics resulting in the formation of a thin and uniform IMC layer at the joint interface. The thermal stability and performance of the joint under high-temperature environments were enhanced due to the Ni–P coating on the substrate. Compared to the unreinforced SAC305 solder joint with bare Cu substrate, joints with SAC305 + 0.05Al2O3 composite showed about 17% higher shear strength with bare Cu substrate and about 27% higher strength with Ni–P coated substrate. The Weibull distribution analysis indicates a significant improvement in joint reliability of the 2220-capacitor/SAC305 solder assembly using SAC305 + 0.05Al2O3 nanocomposite and Ni-coated substrate. The ANOVA study suggests that the solder joint performance majorly depends on the operating environment, solder composition, and the substrate finish. © 2021, The Author(s), under exclusive licence to Springer Science+Business Media, LLC part of Springer Nature.