5. Miscellaneous Publications
Permanent URI for this collectionhttps://idr.nitk.ac.in/handle/123456789/13843
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Item Item Review of microstructure evolution in hypereutectic Al-Si alloys and its effect on wear properties(2014) Vijeesh V.; Prabhu K.N.Al-Si alloys with silicon content more than 13 % are termed as hypereutectic alloys. In recent years, these alloys have drawn the attention of researchers due to their ability to replace cast iron parts in the transportation industry. The properties of the hypereutectic alloy are greatly dependent on the morphology, size and distribution of primary silicon crystals in the alloy. Mechanical properties of the hypereutectic Al-Si alloy can be improved by the simultaneous refinement and modification of the primary and eutectic silicon and by controlling the solidification parameters. In this paper, the effect of solidification rate and melt treatment on the evolution of microstructure in hypereutectic Al-Si alloys are reviewed. Different types of primary silicon morphology and the conditions for its nucleation and growth are explained. The paper discusses the effect of refinement/modification treatments on the microstructure and properties of the hypereutectic Al-Si alloy. The importance and effect of processing variables and phosphorus refinement on the silicon morphology and wear properties of the alloy is highlighted. © 2013 Indian Institute of Metals.Item Review on microstructure evolution in Sn-Ag-Cu solders and its effect on mechanical integrity of solder joints(2013) Sona M.; Prabhu K.N.The use of Pb-bearing solders in electronic assemblies is avoided in many countries due to the inherent toxicity and environmental risks associated with lead. Although a number of "Pb-free" alloys have been invented, none of them meet all the standards generally satisfied by a conventional Pb-Sn alloy. A large number of reliability problems still exist with lead free solder joints. Solder joint reliability depends on mechanical strength, fatigue resistance, hardness, coefficient of thermal expansion which are influenced by the microstructure, type and morphology of inter metallic compounds (IMC). In recent years, Sn rich solders have been considered as suitable replacement for Pb bearing solders. The objective of this review is to study the evolution of microstructural phases in commonly used lead free xSn-yAg-zCu solders and the various factors such as substrate, minor alloying, mechanical and thermo-mechanical strains which affect the microstructure. A complete understanding of the mechanisms that determine the formation and growth of interfacial IMCs is essential for developing solder joints with high reliability. The data available in the open literature have been reviewed and discussed. © 2013 Springer Science+Business Media New York.