5. Miscellaneous Publications
Permanent URI for this collectionhttps://idr.nitk.ac.in/handle/123456789/13843
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Item Data characterizing tensile behavior of cenosphere/HDPE syntactic foam(2016) Kumar B.R.B.; Doddamani, M.; Zeltmann S.E.; Gupta N.; Ramakrishna S.The data set presented is related to the tensile behavior of cenosphere reinforced high density polyethylene syntactic foam composites "Processing of cenosphere/HDPE syntactic foams using an industrial scale polymer injection molding machine" (Bharath et al., 2016) [1]. The focus of the work is on determining the feasibility of using an industrial scale polymer injection molding (PIM) machine for fabricating syntactic foams. The fabricated syntactic foams are investigated for microstructure and tensile properties. The data presented in this article is related to optimization of the PIM process for syntactic foam manufacture, equations and procedures to develop theoretical estimates for properties of cenospheres, and microstructure of syntactic foams before and after failure. Included dataset contains values obtained from the theoretical model. © 2016 The Authors.Item 3D printing of highly pure copper(2019) Tran T.Q.; Chinnappan A.; Lee J.K.Y.; Loc N.H.; Tran L.T.; Wang G.; Kumar V.V.; Jayathilaka W.A.D.M.; Ji D.; Doddamani, M.; Ramakrishna S.Copper has been widely used in many applications due to its outstanding properties such as malleability, high corrosion resistance, and excellent electrical and thermal conductivities. While 3D printing can offer many advantages from layer-by-layer fabrication, the 3D printing of highly pure copper is still challenging due to the thermal issues caused by copper’s high conductivity. This paper presents a comprehensive review of recent work on 3D printing technology of highly pure copper over the past few years. The advantages and current issues of 3D printing methods are compared while different properties of copper parts printed by these methods are summarized. Finally, we provide several potential applications of the 3D printed copper parts and an overview of current developments that could lead to new improvements in this advanced manufacturing field. © 2019 by the authors. Licensee MDPI, Basel, Switzerland.Item