Browsing by Author "Patel, H."

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    Extending network emulation support in ns-3 using DPDK
    (2019) Patel, H.; Hiraskar, H.; Tahiliani, M.P.
    ns-3 network simulator provides support for network emulation by enabling simulated nodes to communicate with real hosts by using a network device called EmuFdNetDevice. Network emulation is an important feature in ns-3 and can be used to validate its models by comparing the emulation results to those obtained from real testbeds. Typically, ns-3 uses raw sockets of host's kernel stack to support network emulation. However, there is an active interest to enhance ns-3's network emulation features by using kernel bypass libraries. Recently, a new network device called NetmapNetDevice has been proposed for ns-3 to enable its interaction with netmap. In this paper, we extend network emulation support in ns-3 by using Data Plane Development Kit (DPDK). DPDK provides a set of fast packet processing libraries to bypass host network stack and obtain a direct access to Network Interface Card (NIC). We propose a new network device in ns-3 called DpdkNetDevice, intermediating between ns-3 Internet stack and DPDK environment to read/write packets from/to the NIC. We validate the working of DpdkNetDevice by performing various experiments and comparing results obtained from it to those obtained from EmuFdNetDevice and NetmapNetDevice. We observe that network emulations using DpdkNetDevice on a Gigabit Ethernet NIC provide higher throughput with significantly lesser CPU cycles per packet. � 2019 ACM.
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    Extending network emulation support in ns-3 using DPDK
    (Association for Computing Machinery, 2019) Patel, H.; Hiraskar, H.; Tahiliani, M.P.
    ns-3 network simulator provides support for network emulation by enabling simulated nodes to communicate with real hosts by using a network device called EmuFdNetDevice. Network emulation is an important feature in ns-3 and can be used to validate its models by comparing the emulation results to those obtained from real testbeds. Typically, ns-3 uses raw sockets of host's kernel stack to support network emulation. However, there is an active interest to enhance ns-3's network emulation features by using kernel bypass libraries. Recently, a new network device called NetmapNetDevice has been proposed for ns-3 to enable its interaction with netmap. In this paper, we extend network emulation support in ns-3 by using Data Plane Development Kit (DPDK). DPDK provides a set of fast packet processing libraries to bypass host network stack and obtain a direct access to Network Interface Card (NIC). We propose a new network device in ns-3 called DpdkNetDevice, intermediating between ns-3 Internet stack and DPDK environment to read/write packets from/to the NIC. We validate the working of DpdkNetDevice by performing various experiments and comparing results obtained from it to those obtained from EmuFdNetDevice and NetmapNetDevice. We observe that network emulations using DpdkNetDevice on a Gigabit Ethernet NIC provide higher throughput with significantly lesser CPU cycles per packet. © 2019 ACM.
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    Microstructure and mechanical properties new magnesium-zinc-gadolinium alloys
    (2016) Seetharaman, S.; Tekumalla, S.; Lalwani, B.; Patel, H.; Bau, N.Q.; Gupta, M.
    Magnesium based materials are effective for structural/component weight reduction in automotive applications. However, their real time applications are limited because of their inadequate mechanical properties, especially the absolute strength and creep resistance. In this regard, the formation of thermally stable ternary compounds is believed to positively influence the properties of Mg-Zn-RE alloys. In this study, new Mg alloys containing Zn and Gd (Mg-2.0Zn-0.5Gd and Mg-3.4Zn-0.8Gd, in at.%) were developed using disintegrated melt deposition technique followed by hot extrusion. The developed alloys were investigated for their microstructural and mechanical properties in hot-extruded conditions. The mechanical properties examined under indentation, tension and compression loads indicated improved mechanical performance due to Zn and Gd addition. The observed mechanical properties are presented using structure-property relationship. Copyright � 2016 by The Minerals, Metals & Materials Society. All rights reserved.
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    Microstructure and mechanical properties new magnesium-zinc-gadolinium alloys
    (Minerals, Metals and Materials Society 184 Thorn Hill Road Warrendale PA 15086, 2016) Seetharaman, S.; Tekumalla, S.; Lalwani, B.; Patel, H.; Bau, N.Q.; Gupta, M.
    Magnesium based materials are effective for structural/component weight reduction in automotive applications. However, their real time applications are limited because of their inadequate mechanical properties, especially the absolute strength and creep resistance. In this regard, the formation of thermally stable ternary compounds is believed to positively influence the properties of Mg-Zn-RE alloys. In this study, new Mg alloys containing Zn and Gd (Mg-2.0Zn-0.5Gd and Mg-3.4Zn-0.8Gd, in at.%) were developed using disintegrated melt deposition technique followed by hot extrusion. The developed alloys were investigated for their microstructural and mechanical properties in hot-extruded conditions. The mechanical properties examined under indentation, tension and compression loads indicated improved mechanical performance due to Zn and Gd addition. The observed mechanical properties are presented using structure-property relationship. © © 2016 by The Minerals, Metals & Materials Society. All rights reserved.