Browsing by Author "Muhammed, H.J."

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    Effect of Ni nanoparticles reinforcement on wettability, microstructure and mechanical properties of SAC387 lead-free solder alloy
    (Elsevier Ltd, 2025) Muhammed, H.J.; Prabhu, K.N.
    The study investigates the influence of nickel (Ni) nanoparticles on the wettability, microstructure, and mechanical properties of Sn-3.8Ag-0.7Cu (SAC387) lead-free solder alloy. Nanocomposite solders containing 0.3 wt% and 0.5 wt% Ni were prepared and reflowed at temperatures of 230 °C, 250 °C, and 270 °C to evaluate their performance on copper substrates with a surface roughness (Ra) of 0.01 ± 0.002 ?m. Wettability improved with increasing reflow temperature; however, the addition of Ni nanoparticles had minimal direct impact on spreading behavior. Microstructural analysis revealed enhanced formation of interfacial intermetallic compounds (IMCs), particularly (Cu,Ni)6Sn5 which contributed to improved joint stability. The optimal mechanical performance was observed at 250 °C with 0.3 wt% Ni addition, yielding a 51.14 % increase in shear strength compared to the unreinforced solder. Microhardness also improved significantly by 43.7 % at the IMC layer and 18.3 % in the solder bulk. Weibull analysis further confirmed higher joint performance with Ni nanoparticle incorporation. These findings highlight the potential of addition of Ni nanoparticles in improving the performance of SAC387 solder joints in electronic packaging. © 2025 Elsevier Ltd
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    Microstructure and Mechanical Properties of Sn-Ag-Cu Nanocomposite Solders: A Review
    (ASTM International, 2025) Muhammed, H.J.; Prabhu, K.N.
    Sn-Ag-Cu (SAC) solder alloy is the most promising lead-free solder alloy, with Sn as the principal constituent. It offers excellent solderability and mechanical properties and addresses the environmental hazards associated with Pb-Sn solders. Key factors affecting the reliability and solderability of the alloy includes wettability, microstructure evolution, intermetallic compound (IMC) growth at the solder-substrate interface, and mechanical properties. The addition of nanoparticles in low weight fractions reduce surface tension, enhances wettability, refines the microstructure, and improves mechanical properties such as shear strength, tensile strength, and microhardness. The improvement in mechanical properties is achieved by inhibiting IMC growth and strengthening the solder matrix. However, excessive nanoparticle additions can adversely affect the properties of solder joints. Despite advancements in lead-free solders, none of the alloys has fully replaced Sn–Pb solders due to challenges in controlling IMC formation during reflow processes. The present work reviews the effects of nanoparticles on the microstructure, mechanical properties, and reliability of SAC solder alloys. The ongoing research on nanocomposite solders should focus on optimizing nanoparticle additions to enhance reliability under thermal cycling and aging conditions. © © 2025 by ASTM International.
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    Microstructure and Mechanical Properties of Sn-Ag-Cu Nanocomposite Solders: A Review
    (ASTM International, 2025) Muhammed, H.J.; Prabhu, K.N.
    Sn-Ag-Cu (SAC) solder alloy is the most promising lead-free solder alloy, with Sn as the principal constituent. It offers excellent solderability and mechanical properties and addresses the environmental hazards associated with Pb-Sn solders. Key factors affecting the reliability and solderability of the alloy includes wettability, microstructure evolution, intermetallic compound (IMC) growth at the solder-substrate interface, and mechanical properties. The addition of nanoparticles in low weight fractions reduce surface tension, enhances wettability, refines the microstructure, and improves mechanical properties such as shear strength, tensile strength, and microhardness. The improvement in mechanical properties is achieved by inhibiting IMC growth and strengthening the solder matrix. However, excessive nanoparticle additions can adversely affect the properties of solder joints. Despite advancements in lead-free solders, none of the alloys has fully replaced Sn–Pb solders due to challenges in controlling IMC formation during reflow processes. The present work reviews the effects of nanoparticles on the microstructure, mechanical properties, and reliability of SAC solder alloys. The ongoing research on nanocomposite solders should focus on optimizing nanoparticle additions to enhance reliability under thermal cycling and aging conditions. © © 2025 by ASTM International.