Browsing by Author "Mruthyunjaya Swamy, K.B."

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    Analysis of Suspension Beams for MEMS Accelerometers: The Effect of Geometric Parameters on the Sensitivity
    (Institute of Electrical and Electronics Engineers Inc., 2024) Manvi, M.; Mruthyunjaya Swamy, K.B.
    MEMS accelerometers have revolutionized accelerometer technology with their compact size, low power consumption and improved precision, making them suitable for measuring the motion and vibration. MEMS accelerometers rely on the movement of springs or beams with attached proof mass to detect acceleration. One important factor that impacts how well these accelerometers detect and measure acceleration is their sensitivity. To explore and improve the sensitivity of MEMS accelerometers, the present work focuses on assessing several beam topologies with various cross-sectional forms, such as triangles, slanted squares, circles, and squares using COMSOL Multiphysics software. Triangular beams made of solid material demonstrated the highest sensitivity (15.68 nm/g), but hollow slanted squares exhibited notable sensitivity (148 nm/g). These results highlight how important the beam configuration and geometric parameters are in determining MEMS accelerometer sensitivity. Understanding this relationship helps researchers refine the design of MEMS accelerometers, leading to improved performance and accuracy in motion and vibration related measurements. © 2024 IEEE.
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    Microelectronic materials, microfabrication processes, micromechanical structural configuration based stiffness evaluation in MEMS: A review
    (Elsevier B.V., 2022) Manvi, M.; Mruthyunjaya Swamy, K.B.
    Microsystem or micro-electro-mechanical system (MEMS) is a revolutionary enabling technology, that is responsible for many of the technological advancements over the past few decades. Many such microsystems consist of suspensions mostly in the form of microcantilevers which are intended to perform desired function by detecting the changes in cantilever bending or vibrational frequency. The bending or deflection of the cantilever beam critically depends upon the mechanical properties, like stiffness, which is contingent on the type of materials, fabrication processes, and structural configurations. This paper evaluates cantilever stiffness of different MEMS devices in relation to aforesaid aspects. Common microelectronic materials like silicon, silicon dioxide, silicon nitride, gold, polymers etc. were seen to provide stiffness ranging from 0.012 N/m to 319.74 N/m that is influenced by elastic modulus & density for a given design. Likewise, fabrication process was seen to affect stiffness through process temperature & residual stress effects for different materials. Also, the structural shape geometry was observed to influence the same due to modified cross-sectional areas and straight & folded spring configurations. In this review, light is shed on abovementioned parameters which are found to be crucial in designing efficient MEMS devices and structures. © 2022 Elsevier B.V.